Package Lead Design with Grooves for Improved Dambar Separation

Package Lead Design with Grooves for Improved Dambar Separation

The invention relates to a package lead design with grooves for improved dambar separation. The lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the...

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Hauptverfasser: CHONG MENG HOW, TAN KAI YANG, NARAYANASAMY JAYAGANASAN, LAM CHEE MING, MURUGAN SANJAY KUMAR, NAVARETNASINGGAM ARIVINDRAN, WANG LEE SHUANG, HOLGADO ELMER SENORIN
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHONG MENG HOW
TAN KAI YANG
NARAYANASAMY JAYAGANASAN
LAM CHEE MING
MURUGAN SANJAY KUMAR
NAVARETNASINGGAM ARIVINDRAN
WANG LEE SHUANG
HOLGADO ELMER SENORIN
description The invention relates to a package lead design with grooves for improved dambar separation. The lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad. 本发明涉及一种具有用于改善的阻挡条分隔的凹槽的封装引线设计。本发明公开了一种引线框架，其包括：管芯焊盘；第一引线，所述第一引线远离管芯焊盘延伸；外围结构，所述外围结构机械地连接到第一引线和管芯焊盘；以及第一凹槽，所述第一凹槽在第一引线的外表面中。第一凹槽远离管芯焊盘沿着第一引线纵向延伸。
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN112216667A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN112216667A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN112216667A3</originalsourceid><addsrcrecordid>eNrjZLAPSEzOTkxPVfBJTUxRcEktzkzPUyjPLMlQcC_Kzy9LLVZIyy9S8MwtKAJygAoSc5MSixSCUwsSixJLMvPzeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGRkaGZmZm5ozExagAq7jAt</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Package Lead Design with Grooves for Improved Dambar Separation</title><source>esp@cenet</source><creator>CHONG MENG HOW ; TAN KAI YANG ; NARAYANASAMY JAYAGANASAN ; LAM CHEE MING ; MURUGAN SANJAY KUMAR ; NAVARETNASINGGAM ARIVINDRAN ; WANG LEE SHUANG ; HOLGADO ELMER SENORIN</creator><creatorcontrib>CHONG MENG HOW ; TAN KAI YANG ; NARAYANASAMY JAYAGANASAN ; LAM CHEE MING ; MURUGAN SANJAY KUMAR ; NAVARETNASINGGAM ARIVINDRAN ; WANG LEE SHUANG ; HOLGADO ELMER SENORIN</creatorcontrib><description>The invention relates to a package lead design with grooves for improved dambar separation. The lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad. 本发明涉及一种具有用于改善的阻挡条分隔的凹槽的封装引线设计。本发明公开了一种引线框架，其包括：管芯焊盘；第一引线，所述第一引线远离管芯焊盘延伸；外围结构，所述外围结构机械地连接到第一引线和管芯焊盘；以及第一凹槽，所述第一凹槽在第一引线的外表面中。第一凹槽远离管芯焊盘沿着第一引线纵向延伸。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210112&amp;DB=EPODOC&amp;CC=CN&amp;NR=112216667A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210112&amp;DB=EPODOC&amp;CC=CN&amp;NR=112216667A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHONG MENG HOW</creatorcontrib><creatorcontrib>TAN KAI YANG</creatorcontrib><creatorcontrib>NARAYANASAMY JAYAGANASAN</creatorcontrib><creatorcontrib>LAM CHEE MING</creatorcontrib><creatorcontrib>MURUGAN SANJAY KUMAR</creatorcontrib><creatorcontrib>NAVARETNASINGGAM ARIVINDRAN</creatorcontrib><creatorcontrib>WANG LEE SHUANG</creatorcontrib><creatorcontrib>HOLGADO ELMER SENORIN</creatorcontrib><title>Package Lead Design with Grooves for Improved Dambar Separation</title><description>The invention relates to a package lead design with grooves for improved dambar separation. The lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad. 本发明涉及一种具有用于改善的阻挡条分隔的凹槽的封装引线设计。本发明公开了一种引线框架，其包括：管芯焊盘；第一引线，所述第一引线远离管芯焊盘延伸；外围结构，所述外围结构机械地连接到第一引线和管芯焊盘；以及第一凹槽，所述第一凹槽在第一引线的外表面中。第一凹槽远离管芯焊盘沿着第一引线纵向延伸。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPSEzOTkxPVfBJTUxRcEktzkzPUyjPLMlQcC_Kzy9LLVZIyy9S8MwtKAJygAoSc5MSixSCUwsSixJLMvPzeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGRkaGZmZm5ozExagAq7jAt</recordid><startdate>20210112</startdate><enddate>20210112</enddate><creator>CHONG MENG HOW</creator><creator>TAN KAI YANG</creator><creator>NARAYANASAMY JAYAGANASAN</creator><creator>LAM CHEE MING</creator><creator>MURUGAN SANJAY KUMAR</creator><creator>NAVARETNASINGGAM ARIVINDRAN</creator><creator>WANG LEE SHUANG</creator><creator>HOLGADO ELMER SENORIN</creator><scope>EVB</scope></search><sort><creationdate>20210112</creationdate><title>Package Lead Design with Grooves for Improved Dambar Separation</title><author>CHONG MENG HOW ; TAN KAI YANG ; NARAYANASAMY JAYAGANASAN ; LAM CHEE MING ; MURUGAN SANJAY KUMAR ; NAVARETNASINGGAM ARIVINDRAN ; WANG LEE SHUANG ; HOLGADO ELMER SENORIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112216667A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHONG MENG HOW</creatorcontrib><creatorcontrib>TAN KAI YANG</creatorcontrib><creatorcontrib>NARAYANASAMY JAYAGANASAN</creatorcontrib><creatorcontrib>LAM CHEE MING</creatorcontrib><creatorcontrib>MURUGAN SANJAY KUMAR</creatorcontrib><creatorcontrib>NAVARETNASINGGAM ARIVINDRAN</creatorcontrib><creatorcontrib>WANG LEE SHUANG</creatorcontrib><creatorcontrib>HOLGADO ELMER SENORIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHONG MENG HOW</au><au>TAN KAI YANG</au><au>NARAYANASAMY JAYAGANASAN</au><au>LAM CHEE MING</au><au>MURUGAN SANJAY KUMAR</au><au>NAVARETNASINGGAM ARIVINDRAN</au><au>WANG LEE SHUANG</au><au>HOLGADO ELMER SENORIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package Lead Design with Grooves for Improved Dambar Separation</title><date>2021-01-12</date><risdate>2021</risdate><abstract>The invention relates to a package lead design with grooves for improved dambar separation. The lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad. 本发明涉及一种具有用于改善的阻挡条分隔的凹槽的封装引线设计。本发明公开了一种引线框架，其包括：管芯焊盘；第一引线，所述第一引线远离管芯焊盘延伸；外围结构，所述外围结构机械地连接到第一引线和管芯焊盘；以及第一凹槽，所述第一凹槽在第一引线的外表面中。第一凹槽远离管芯焊盘沿着第一引线纵向延伸。</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Package Lead Design with Grooves for Improved Dambar Separation
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