Laser processing method and laser processing apparatus

The purpose of the present invention is to detect that a hole has passed through a glass substrate when the glass substrate is perforated with a laser beam. A laser processing device is provided with:a table on which a substrate to be processed is placed; a laser irradiation system that irradiates t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YASUHIKO KITA, ICHIKAWA KENICHI, ITO YASUSHI, NISHIBE TATSUYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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