Packaging structure and process of power supply module

Packaging structure and process of power supply module

The invention discloses a packaging structure and process of a power supply module, and belongs to the technical field of electronic packaging. The packaging structure of the power supply module comprises a ceramic shell and a power supply bare chip, wherein the power supply bare chip and the cerami...

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Hauptverfasser: SHI LIYING, DING RONGZHENG, ZUO QIAOFENG, LUO YONGBO
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SHI LIYING
DING RONGZHENG
ZUO QIAOFENG
LUO YONGBO
description The invention discloses a packaging structure and process of a power supply module, and belongs to the technical field of electronic packaging. The packaging structure of the power supply module comprises a ceramic shell and a power supply bare chip, wherein the power supply bare chip and the ceramic shell on the two sides are bonded through a plurality of metal wires to form interconnection; a ceramic cover plate fixedly connected with the ceramic shell is arranged above the power supply bare chip; the top surface of the ceramic shell is fixedly connected with a metal cover plate through a sealing ring; and a plurality of discrete devices and passive elements are arranged in the sealing ring. The packaging structure of the power supply module is an embedded laminated sealing cavity structure, and the power supply bare chip is sealed firstly, so that the influence of a subsequent packaging process on the power supply bare chip is avoided; and the power supply bare chip, a heat sink, the discrete devices, the
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Packaging structure and process of power supply module
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