THERMALLY-CONDUCTIVE GAP FILLER
Thermally-conductive gap fillers are described. The gap fillers comprise a matrix polymer, a thermally-conductive filler, and a liquid flame retardant plasticizer. 本发明描述了导热间隙填料。该间隙填料包含基体聚合物、导热填料和液体阻燃增塑剂。
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Thermally-conductive gap fillers are described. The gap fillers comprise a matrix polymer, a thermally-conductive filler, and a liquid flame retardant plasticizer.
本发明描述了导热间隙填料。该间隙填料包含基体聚合物、导热填料和液体阻燃增塑剂。 |
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