EXTREME UNIFORMITY HEATED SUBSTRATE SUPPORT ASSEMBLY
Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided thatincludes a body. The body made from ceramic. The body having a workpiece support surface and a mounti...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LUBOMIRSKY DMITRY FLOYD KIRBY H SAMIR MEHMET TUGRUL WANG JUSTIN PARKHE VIJAY D KORA SIDDARAMAIAH ONKARA SWAMY BENJAMINSON DAVID |
| description | Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided thatincludes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 micronsflat.
本文中所述的实施方式提供了一种实现跨工件表面的温度均匀性的基板支撑组件。在一个实施例中，提供了一种基板支撑组件，所述基板支撑组件包括主体。所述主体由陶瓷制作。所述主体具有工件支撑表面及安装表面。所述工件支撑表面及粘合吸盘主体表面具有小于10微米的平坦度。第一加热器被设置在底表面上在所述主体外部。粘合层被设置在所述第一加热器之上，其中所述粘合层是电绝缘的，且冷却基部具有由金属制作的主体。所述冷却主体具有上冷却主体表面及下冷却主体表面，其中 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN112088427A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN112088427A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN112088427A3</originalsourceid><addsrcrecordid>eNrjZDBxjQgJcvV1VQj183TzD_L1DIlU8HB1DHF1UQgOdQoOCQIygayAAP-gEAXH4GBXXyefSB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu_sZ2hoZGBhYWJk7mhMjBoABz4n8g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EXTREME UNIFORMITY HEATED SUBSTRATE SUPPORT ASSEMBLY</title><source>esp@cenet</source><creator>LUBOMIRSKY DMITRY ; FLOYD KIRBY H ; SAMIR MEHMET TUGRUL ; WANG JUSTIN ; PARKHE VIJAY D ; KORA SIDDARAMAIAH ONKARA SWAMY ; BENJAMINSON DAVID</creator><creatorcontrib>LUBOMIRSKY DMITRY ; FLOYD KIRBY H ; SAMIR MEHMET TUGRUL ; WANG JUSTIN ; PARKHE VIJAY D ; KORA SIDDARAMAIAH ONKARA SWAMY ; BENJAMINSON DAVID</creatorcontrib><description>Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided thatincludes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 micronsflat.
本文中所述的实施方式提供了一种实现跨工件表面的温度均匀性的基板支撑组件。在一个实施例中，提供了一种基板支撑组件，所述基板支撑组件包括主体。所述主体由陶瓷制作。所述主体具有工件支撑表面及安装表面。所述工件支撑表面及粘合吸盘主体表面具有小于10微米的平坦度。第一加热器被设置在底表面上在所述主体外部。粘合层被设置在所述第一加热器之上，其中所述粘合层是电绝缘的，且冷却基部具有由金属制作的主体。所述冷却主体具有上冷却主体表面及下冷却主体表面，其中</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201215&DB=EPODOC&CC=CN&NR=112088427A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201215&DB=EPODOC&CC=CN&NR=112088427A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LUBOMIRSKY DMITRY</creatorcontrib><creatorcontrib>FLOYD KIRBY H</creatorcontrib><creatorcontrib>SAMIR MEHMET TUGRUL</creatorcontrib><creatorcontrib>WANG JUSTIN</creatorcontrib><creatorcontrib>PARKHE VIJAY D</creatorcontrib><creatorcontrib>KORA SIDDARAMAIAH ONKARA SWAMY</creatorcontrib><creatorcontrib>BENJAMINSON DAVID</creatorcontrib><title>EXTREME UNIFORMITY HEATED SUBSTRATE SUPPORT ASSEMBLY</title><description>Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided thatincludes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 micronsflat.
本文中所述的实施方式提供了一种实现跨工件表面的温度均匀性的基板支撑组件。在一个实施例中，提供了一种基板支撑组件，所述基板支撑组件包括主体。所述主体由陶瓷制作。所述主体具有工件支撑表面及安装表面。所述工件支撑表面及粘合吸盘主体表面具有小于10微米的平坦度。第一加热器被设置在底表面上在所述主体外部。粘合层被设置在所述第一加热器之上，其中所述粘合层是电绝缘的，且冷却基部具有由金属制作的主体。所述冷却主体具有上冷却主体表面及下冷却主体表面，其中</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBxjQgJcvV1VQj183TzD_L1DIlU8HB1DHF1UQgOdQoOCQIygayAAP-gEAXH4GBXXyefSB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu_sZ2hoZGBhYWJk7mhMjBoABz4n8g</recordid><startdate>20201215</startdate><enddate>20201215</enddate><creator>LUBOMIRSKY DMITRY</creator><creator>FLOYD KIRBY H</creator><creator>SAMIR MEHMET TUGRUL</creator><creator>WANG JUSTIN</creator><creator>PARKHE VIJAY D</creator><creator>KORA SIDDARAMAIAH ONKARA SWAMY</creator><creator>BENJAMINSON DAVID</creator><scope>EVB</scope></search><sort><creationdate>20201215</creationdate><title>EXTREME UNIFORMITY HEATED SUBSTRATE SUPPORT ASSEMBLY</title><author>LUBOMIRSKY DMITRY ; FLOYD KIRBY H ; SAMIR MEHMET TUGRUL ; WANG JUSTIN ; PARKHE VIJAY D ; KORA SIDDARAMAIAH ONKARA SWAMY ; BENJAMINSON DAVID</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112088427A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LUBOMIRSKY DMITRY</creatorcontrib><creatorcontrib>FLOYD KIRBY H</creatorcontrib><creatorcontrib>SAMIR MEHMET TUGRUL</creatorcontrib><creatorcontrib>WANG JUSTIN</creatorcontrib><creatorcontrib>PARKHE VIJAY D</creatorcontrib><creatorcontrib>KORA SIDDARAMAIAH ONKARA SWAMY</creatorcontrib><creatorcontrib>BENJAMINSON DAVID</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LUBOMIRSKY DMITRY</au><au>FLOYD KIRBY H</au><au>SAMIR MEHMET TUGRUL</au><au>WANG JUSTIN</au><au>PARKHE VIJAY D</au><au>KORA SIDDARAMAIAH ONKARA SWAMY</au><au>BENJAMINSON DAVID</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EXTREME UNIFORMITY HEATED SUBSTRATE SUPPORT ASSEMBLY</title><date>2020-12-15</date><risdate>2020</risdate><abstract>Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided thatincludes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 micronsflat.
本文中所述的实施方式提供了一种实现跨工件表面的温度均匀性的基板支撑组件。在一个实施例中，提供了一种基板支撑组件，所述基板支撑组件包括主体。所述主体由陶瓷制作。所述主体具有工件支撑表面及安装表面。所述工件支撑表面及粘合吸盘主体表面具有小于10微米的平坦度。第一加热器被设置在底表面上在所述主体外部。粘合层被设置在所述第一加热器之上，其中所述粘合层是电绝缘的，且冷却基部具有由金属制作的主体。所述冷却主体具有上冷却主体表面及下冷却主体表面，其中</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN112088427A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | EXTREME UNIFORMITY HEATED SUBSTRATE SUPPORT ASSEMBLY |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T13%3A17%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LUBOMIRSKY%20DMITRY&rft.date=2020-12-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN112088427A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |