APPARATUS FOR CONDUCTING HEAT
An apparatus for conducting heat, comprising a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate comprises a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a s...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | RAPINOJA HANNA HARTIKAINEN PYRY KARPPA JAANI |
description | An apparatus for conducting heat, comprising a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate comprises a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.
本发明提供了一种用于传导热的装置,该装置包括基板,该基板用于接纳一个或更多个电气部件和热物质循环系统。基板包括用于接纳热物质循环系统的第一部分的第一接口和用于接纳热物质循环系统的第二部分的第二接口,使得基板在使用时与第一接口和第二接口之间的循环系统的热物质接触。基板是导热的,以用于在一个或更多个电气部件与循环系统的热物质之间传递热。 |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN112020269A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN112020269A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN112020269A3</originalsourceid><addsrcrecordid>eNrjZJB1DAhwDHIMCQ1WcPMPUnD293MJdQ7x9HNX8HB1DOFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGRgZAaGbpaEyMGgCPwCD6</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>APPARATUS FOR CONDUCTING HEAT</title><source>esp@cenet</source><creator>RAPINOJA HANNA ; HARTIKAINEN PYRY ; KARPPA JAANI</creator><creatorcontrib>RAPINOJA HANNA ; HARTIKAINEN PYRY ; KARPPA JAANI</creatorcontrib><description>An apparatus for conducting heat, comprising a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate comprises a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.
本发明提供了一种用于传导热的装置,该装置包括基板,该基板用于接纳一个或更多个电气部件和热物质循环系统。基板包括用于接纳热物质循环系统的第一部分的第一接口和用于接纳热物质循环系统的第二部分的第二接口,使得基板在使用时与第一接口和第二接口之间的循环系统的热物质接触。基板是导热的,以用于在一个或更多个电气部件与循环系统的热物质之间传递热。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201201&DB=EPODOC&CC=CN&NR=112020269A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201201&DB=EPODOC&CC=CN&NR=112020269A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAPINOJA HANNA</creatorcontrib><creatorcontrib>HARTIKAINEN PYRY</creatorcontrib><creatorcontrib>KARPPA JAANI</creatorcontrib><title>APPARATUS FOR CONDUCTING HEAT</title><description>An apparatus for conducting heat, comprising a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate comprises a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.
本发明提供了一种用于传导热的装置,该装置包括基板,该基板用于接纳一个或更多个电气部件和热物质循环系统。基板包括用于接纳热物质循环系统的第一部分的第一接口和用于接纳热物质循环系统的第二部分的第二接口,使得基板在使用时与第一接口和第二接口之间的循环系统的热物质接触。基板是导热的,以用于在一个或更多个电气部件与循环系统的热物质之间传递热。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB1DAhwDHIMCQ1WcPMPUnD293MJdQ7x9HNX8HB1DOFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGRgZAaGbpaEyMGgCPwCD6</recordid><startdate>20201201</startdate><enddate>20201201</enddate><creator>RAPINOJA HANNA</creator><creator>HARTIKAINEN PYRY</creator><creator>KARPPA JAANI</creator><scope>EVB</scope></search><sort><creationdate>20201201</creationdate><title>APPARATUS FOR CONDUCTING HEAT</title><author>RAPINOJA HANNA ; HARTIKAINEN PYRY ; KARPPA JAANI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112020269A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>RAPINOJA HANNA</creatorcontrib><creatorcontrib>HARTIKAINEN PYRY</creatorcontrib><creatorcontrib>KARPPA JAANI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAPINOJA HANNA</au><au>HARTIKAINEN PYRY</au><au>KARPPA JAANI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR CONDUCTING HEAT</title><date>2020-12-01</date><risdate>2020</risdate><abstract>An apparatus for conducting heat, comprising a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate comprises a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.
本发明提供了一种用于传导热的装置,该装置包括基板,该基板用于接纳一个或更多个电气部件和热物质循环系统。基板包括用于接纳热物质循环系统的第一部分的第一接口和用于接纳热物质循环系统的第二部分的第二接口,使得基板在使用时与第一接口和第二接口之间的循环系统的热物质接触。基板是导热的,以用于在一个或更多个电气部件与循环系统的热物质之间传递热。</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN112020269A |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | APPARATUS FOR CONDUCTING HEAT |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T02%3A00%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=RAPINOJA%20HANNA&rft.date=2020-12-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN112020269A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |