Packaging support structure and light-emitting device comprising packaging support structure

The invention provides a packaging support structure and a light-emitting device comprising a packaging support structure. The packaging support structure comprises a shell, wherein the shell comprises a light emitting surface, a backlight surface, a bottom surface and a groove; and a conductive sup...

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Hauptverfasser: YANG HAOYU, LI YUDA, KANG JIEYOU, LIU JIANNAN, CHEN DENGWEI
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Sprache:chi ; eng
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creator YANG HAOYU
LI YUDA
KANG JIEYOU
LIU JIANNAN
CHEN DENGWEI
description The invention provides a packaging support structure and a light-emitting device comprising a packaging support structure. The packaging support structure comprises a shell, wherein the shell comprises a light emitting surface, a backlight surface, a bottom surface and a groove; and a conductive support, which is partially wrapped by the shell and comprises a first pin and a second pin which are separated from each other, wherein the first pin and the second pin each comprise an electrode part and a bending part, and the electrode parts are exposed out of the shell through the groove, and thebending part and the electrode parts extend outwards to the outside of the shell and are bent towards the bottom surface of the shell. One of the first pin and the second pin further comprises a heatdissipation part, and the heat dissipation part extends outwards from the electrode part and is exposed out of the backlight surface of the shell. The packaging support structure provided by the embodiment achieves the effects
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN111987212A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN111987212A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN111987212A3</originalsourceid><addsrcrecordid>eNrjZIgJSEzOTkzPzEtXKC4tKMgvKlEoLikqTS4pLUpVSMxLUcjJTM8o0U3NzSwpASlKSS3LTE5VSM7PLSjKLAaJFOA2gIeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYDdabmpZbEO_sZGhpaWpgbGRo5GhOjBgBbHj0t</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Packaging support structure and light-emitting device comprising packaging support structure</title><source>esp@cenet</source><creator>YANG HAOYU ; LI YUDA ; KANG JIEYOU ; LIU JIANNAN ; CHEN DENGWEI</creator><creatorcontrib>YANG HAOYU ; LI YUDA ; KANG JIEYOU ; LIU JIANNAN ; CHEN DENGWEI</creatorcontrib><description>The invention provides a packaging support structure and a light-emitting device comprising a packaging support structure. The packaging support structure comprises a shell, wherein the shell comprises a light emitting surface, a backlight surface, a bottom surface and a groove; and a conductive support, which is partially wrapped by the shell and comprises a first pin and a second pin which are separated from each other, wherein the first pin and the second pin each comprise an electrode part and a bending part, and the electrode parts are exposed out of the shell through the groove, and thebending part and the electrode parts extend outwards to the outside of the shell and are bent towards the bottom surface of the shell. One of the first pin and the second pin further comprises a heatdissipation part, and the heat dissipation part extends outwards from the electrode part and is exposed out of the backlight surface of the shell. The packaging support structure provided by the embodiment achieves the effects</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201124&amp;DB=EPODOC&amp;CC=CN&amp;NR=111987212A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201124&amp;DB=EPODOC&amp;CC=CN&amp;NR=111987212A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG HAOYU</creatorcontrib><creatorcontrib>LI YUDA</creatorcontrib><creatorcontrib>KANG JIEYOU</creatorcontrib><creatorcontrib>LIU JIANNAN</creatorcontrib><creatorcontrib>CHEN DENGWEI</creatorcontrib><title>Packaging support structure and light-emitting device comprising packaging support structure</title><description>The invention provides a packaging support structure and a light-emitting device comprising a packaging support structure. The packaging support structure comprises a shell, wherein the shell comprises a light emitting surface, a backlight surface, a bottom surface and a groove; and a conductive support, which is partially wrapped by the shell and comprises a first pin and a second pin which are separated from each other, wherein the first pin and the second pin each comprise an electrode part and a bending part, and the electrode parts are exposed out of the shell through the groove, and thebending part and the electrode parts extend outwards to the outside of the shell and are bent towards the bottom surface of the shell. One of the first pin and the second pin further comprises a heatdissipation part, and the heat dissipation part extends outwards from the electrode part and is exposed out of the backlight surface of the shell. The packaging support structure provided by the embodiment achieves the effects</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgJSEzOTkzPzEtXKC4tKMgvKlEoLikqTS4pLUpVSMxLUcjJTM8o0U3NzSwpASlKSS3LTE5VSM7PLSjKLAaJFOA2gIeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYDdabmpZbEO_sZGhpaWpgbGRo5GhOjBgBbHj0t</recordid><startdate>20201124</startdate><enddate>20201124</enddate><creator>YANG HAOYU</creator><creator>LI YUDA</creator><creator>KANG JIEYOU</creator><creator>LIU JIANNAN</creator><creator>CHEN DENGWEI</creator><scope>EVB</scope></search><sort><creationdate>20201124</creationdate><title>Packaging support structure and light-emitting device comprising packaging support structure</title><author>YANG HAOYU ; LI YUDA ; KANG JIEYOU ; LIU JIANNAN ; CHEN DENGWEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111987212A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG HAOYU</creatorcontrib><creatorcontrib>LI YUDA</creatorcontrib><creatorcontrib>KANG JIEYOU</creatorcontrib><creatorcontrib>LIU JIANNAN</creatorcontrib><creatorcontrib>CHEN DENGWEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG HAOYU</au><au>LI YUDA</au><au>KANG JIEYOU</au><au>LIU JIANNAN</au><au>CHEN DENGWEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaging support structure and light-emitting device comprising packaging support structure</title><date>2020-11-24</date><risdate>2020</risdate><abstract>The invention provides a packaging support structure and a light-emitting device comprising a packaging support structure. The packaging support structure comprises a shell, wherein the shell comprises a light emitting surface, a backlight surface, a bottom surface and a groove; and a conductive support, which is partially wrapped by the shell and comprises a first pin and a second pin which are separated from each other, wherein the first pin and the second pin each comprise an electrode part and a bending part, and the electrode parts are exposed out of the shell through the groove, and thebending part and the electrode parts extend outwards to the outside of the shell and are bent towards the bottom surface of the shell. One of the first pin and the second pin further comprises a heatdissipation part, and the heat dissipation part extends outwards from the electrode part and is exposed out of the backlight surface of the shell. The packaging support structure provided by the embodiment achieves the effects</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Packaging support structure and light-emitting device comprising packaging support structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T18%3A58%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YANG%20HAOYU&rft.date=2020-11-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN111987212A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true