Method for calculating COG hot-pressing process parameters

The invention discloses a method for calculating COG hot-pressing process parameters. The method comprises the steps that a COG pressing value expression is constructed according to the IC thickness,the ACF thickness and the glass thickness of a product, a pressing value actually needing to be set b...

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Bibliographische Detailangaben
Hauptverfasser:	LI CHAO, HAN ZHE, XU CHANGYUAN, XIAN XIAOCONG, WEN JITIAN, YANG ZHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	The invention discloses a method for calculating COG hot-pressing process parameters. The method comprises the steps that a COG pressing value expression is constructed according to the IC thickness,the ACF thickness and the glass thickness of a product, a pressing value actually needing to be set by a COG pressing head is calculated according to the expression, and the calculation formula of thepressing value actually needing to be set by the COG pressing head is shown as follows: S = A-(B-(C + D + E)) + F, wherein S is a pressing value actually required to be set by the COG pressing head,A is a Z-axis reference quantity set in the COG pressing head servo system, B is the actual distance between the lower part of the pressing head and the upper part of a back-supporting platform, C isthe total thickness of the IC including Bump, D is the thickness of the glass, E is the ACF thickness obtained according to the specification, and F is an empirical constant. According to the method for calculating COG hot-press