Solder resist ink, preparation method thereof and circuit board

The invention is applicable to the technical field of circuit board processing, and provides solder resist ink, a preparation method thereof and a circuit board. The solder resist ink comprises the following components: epoxy acrylic resin, carboxyl acrylic resin, an ultraviolet curing monomer, a so...

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Bibliographische Detailangaben
Hauptverfasser:	LI BIAO, CAO ZHIBIN, SHA WANGBO, LI YAO, WU JUNBAO, LI FAJIA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS USE OF MATERIALS THEREFOR WOODSTAINS
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