Recyclable electronic circuit with paper substrate and preparation method and recycling method of recyclable electronic circuit
The invention discloses a preparation method of a recyclable electronic circuit with a paper substrate. A first conductive circuit layer is prepared by adopting a laser etching stripping process, thelaser etching stripping process does not need the help of any tool, the manufacturing of the complex...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a preparation method of a recyclable electronic circuit with a paper substrate. A first conductive circuit layer is prepared by adopting a laser etching stripping process, thelaser etching stripping process does not need the help of any tool, the manufacturing of the complex electronic circuit can be completed quickly and flexibly, and the laser processing precision and position control precision are high and are incomparable to die cutting processes. The paper substrate can be recycled after the electronic circuit manufactured by the aid of the method is used, and themaximum recovery rate can reach 95%.
本发明公开了一种纸质基材可回收型电子线路的制备方法,采用激光刻蚀剥离工艺制得第一导电线路层,激光刻蚀剥离工艺不需要任何工具的帮助,可以快速而灵活的完成复杂电子线路的制作,激光的加工精度和位置控制精度都较高,是模切工艺无法比拟的,通过本发明制备的电子线路在使用完毕后,纸质基材可以进行再回收利用,最大回收率可达95%。 |
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