Microelectronic device with patterned surface structure

The invention relates to a microelectronic device with a patterned surface structure. The invention discloses a connecting structure and a manufacturing method thereof. The connection structure comprises a semiconductor substrate, a metal layer, a passivation layer and a conductive structure. The metal layer is over the semiconductor substrate. The passivation layer is located above the metal layer and includes an opening. The conductive structure has a patterned surface structure that is in contact with the metal layer through the opening of the passivation layer. Therefore, according to theconnecting structure and the manufacturing method of the connecting structure, the patterned surface structure of the connecting structure can improve wafer warping during reflow soldering, so that wafer breakage is avoided, reliability is improved, and the overall warping level is reduced. 本申请涉及具有图案化表面结构的微电子装置。本发明公开了一种连接结构及其制造方法。该连接结构包含半导体基板、金属层、钝化层以及导电结构。金属层位于半导体基板的上方。钝化层位于金属层的上方，且包含一个开口。导电结构具有图案化表面结构，图案化表面结构通过钝化层的开口与金属