All-sealed power electronic equipment heat radiation casing
The invention discloses an all-sealed power electronic equipment heat dissipation casing, wherein a casing body at the bottom and two side surfaces of the casing is of a three-layer hollow structure,the inner layer of the casing is used for sealing all the electronic equipment in the casing, and the...
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| creator | ZHU DECHUN LIU WANGTING FAN ZHIGANG YANG LONGFEI ZHANG WEIMIN MO FEI |
| description | The invention discloses an all-sealed power electronic equipment heat dissipation casing, wherein a casing body at the bottom and two side surfaces of the casing is of a three-layer hollow structure,the inner layer of the casing is used for sealing all the electronic equipment in the casing, and the casing realizes air cooling heat exchange through an integrated heat dissipation flow channel located on the casing. the integrated heat dissipation flow channel comprises a closed heat exchange flow channel located at the bottom and the side face of the machine shell, wherein first heat dissipation fins are arranged in the closed heat exchange flow channel, a draught fan is arranged at the bottom of the machine shell, an anti-reverse flow guide piece is arranged at an air inlet in the bottom,and second heat dissipation fins are arranged at the top of the outer-layer machine shell. Directional jet flow holes are formed in the junctions of the closed heat exchange flow channels and the second cooling fins located a |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN111885882A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN111885882A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN111885882A3</originalsourceid><addsrcrecordid>eNrjZLB2zMnRLU5NzElNUSjIL08tUkjNSU0uKcrPy0xWSC0szSzITc0rUchITSxRKEpMyUwsyczPU0hOLM7MS-dhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhhYWphYWRo7GxKgBAL-sL6k</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>All-sealed power electronic equipment heat radiation casing</title><source>esp@cenet</source><creator>ZHU DECHUN ; LIU WANGTING ; FAN ZHIGANG ; YANG LONGFEI ; ZHANG WEIMIN ; MO FEI</creator><creatorcontrib>ZHU DECHUN ; LIU WANGTING ; FAN ZHIGANG ; YANG LONGFEI ; ZHANG WEIMIN ; MO FEI</creatorcontrib><description>The invention discloses an all-sealed power electronic equipment heat dissipation casing, wherein a casing body at the bottom and two side surfaces of the casing is of a three-layer hollow structure,the inner layer of the casing is used for sealing all the electronic equipment in the casing, and the casing realizes air cooling heat exchange through an integrated heat dissipation flow channel located on the casing. the integrated heat dissipation flow channel comprises a closed heat exchange flow channel located at the bottom and the side face of the machine shell, wherein first heat dissipation fins are arranged in the closed heat exchange flow channel, a draught fan is arranged at the bottom of the machine shell, an anti-reverse flow guide piece is arranged at an air inlet in the bottom,and second heat dissipation fins are arranged at the top of the outer-layer machine shell. Directional jet flow holes are formed in the junctions of the closed heat exchange flow channels and the second cooling fins located a</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201103&DB=EPODOC&CC=CN&NR=111885882A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201103&DB=EPODOC&CC=CN&NR=111885882A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHU DECHUN</creatorcontrib><creatorcontrib>LIU WANGTING</creatorcontrib><creatorcontrib>FAN ZHIGANG</creatorcontrib><creatorcontrib>YANG LONGFEI</creatorcontrib><creatorcontrib>ZHANG WEIMIN</creatorcontrib><creatorcontrib>MO FEI</creatorcontrib><title>All-sealed power electronic equipment heat radiation casing</title><description>The invention discloses an all-sealed power electronic equipment heat dissipation casing, wherein a casing body at the bottom and two side surfaces of the casing is of a three-layer hollow structure,the inner layer of the casing is used for sealing all the electronic equipment in the casing, and the casing realizes air cooling heat exchange through an integrated heat dissipation flow channel located on the casing. the integrated heat dissipation flow channel comprises a closed heat exchange flow channel located at the bottom and the side face of the machine shell, wherein first heat dissipation fins are arranged in the closed heat exchange flow channel, a draught fan is arranged at the bottom of the machine shell, an anti-reverse flow guide piece is arranged at an air inlet in the bottom,and second heat dissipation fins are arranged at the top of the outer-layer machine shell. Directional jet flow holes are formed in the junctions of the closed heat exchange flow channels and the second cooling fins located a</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB2zMnRLU5NzElNUSjIL08tUkjNSU0uKcrPy0xWSC0szSzITc0rUchITSxRKEpMyUwsyczPU0hOLM7MS-dhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhhYWphYWRo7GxKgBAL-sL6k</recordid><startdate>20201103</startdate><enddate>20201103</enddate><creator>ZHU DECHUN</creator><creator>LIU WANGTING</creator><creator>FAN ZHIGANG</creator><creator>YANG LONGFEI</creator><creator>ZHANG WEIMIN</creator><creator>MO FEI</creator><scope>EVB</scope></search><sort><creationdate>20201103</creationdate><title>All-sealed power electronic equipment heat radiation casing</title><author>ZHU DECHUN ; LIU WANGTING ; FAN ZHIGANG ; YANG LONGFEI ; ZHANG WEIMIN ; MO FEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111885882A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHU DECHUN</creatorcontrib><creatorcontrib>LIU WANGTING</creatorcontrib><creatorcontrib>FAN ZHIGANG</creatorcontrib><creatorcontrib>YANG LONGFEI</creatorcontrib><creatorcontrib>ZHANG WEIMIN</creatorcontrib><creatorcontrib>MO FEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHU DECHUN</au><au>LIU WANGTING</au><au>FAN ZHIGANG</au><au>YANG LONGFEI</au><au>ZHANG WEIMIN</au><au>MO FEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>All-sealed power electronic equipment heat radiation casing</title><date>2020-11-03</date><risdate>2020</risdate><abstract>The invention discloses an all-sealed power electronic equipment heat dissipation casing, wherein a casing body at the bottom and two side surfaces of the casing is of a three-layer hollow structure,the inner layer of the casing is used for sealing all the electronic equipment in the casing, and the casing realizes air cooling heat exchange through an integrated heat dissipation flow channel located on the casing. the integrated heat dissipation flow channel comprises a closed heat exchange flow channel located at the bottom and the side face of the machine shell, wherein first heat dissipation fins are arranged in the closed heat exchange flow channel, a draught fan is arranged at the bottom of the machine shell, an anti-reverse flow guide piece is arranged at an air inlet in the bottom,and second heat dissipation fins are arranged at the top of the outer-layer machine shell. Directional jet flow holes are formed in the junctions of the closed heat exchange flow channels and the second cooling fins located a</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | All-sealed power electronic equipment heat radiation casing |
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