Semiconductor package having multi-stage conductive clip for top side cooling

A semiconductor package includes: a die pad having a die attach surface; a semiconductor die mounted on the die attach surface and having a first bond pad at an upper surface facing away from the dieattach surface; and an interconnect clip including a first section at least partially surrounding the central opening, a second section offset from the first section in a vertical direction and spacedapart from the first section, and a support extending between the first section and the second section. The package also includes an electrically insulating encapsulant covering the semiconductor die. The upper surface of the first section of the interconnect clip is exposed from the planar surface of the encapsulant. The lower surface of the second section is flush with the upper surface of thesemiconductor die, and the lower surface of the second section is conductively connected to the first bonding pad. 一种半导体封装包括：具有管芯附接表面的管芯焊盘；被安装在管芯附接表面上的半导体管芯，并且所述半导体管芯在背离所述管芯附接表面的上表面处具有第一接合焊盘；互连夹，所述互连夹包括至少部分地包围中央开口的第一区段、在垂直方向上从第