Packaging film production mold

The invention discloses a packaging film production mold, and particularly relates to the field of molds. The packaging film production mold comprises a lower mold mechanism, an upper mold mechanism is fixedly installed at the top of the lower mold mechanism, an upper supporting part is welded to th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GAO ERJUN, LI CHENHONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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