Method for manufacturing high-integration microarray LED packaging module

The invention provides a method for manufacturing a high-integration microarray LED packaging module. The method comprises the steps of S1, providing an LED prefabricated part which comprises a microarray lens cover plate and an epitaxial wafer, and cleaning the surface of the epitaxial wafer; S2, c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG XIAOPENG, LI FENG, YANG SISI, HAO JINGLONG, WANG HAOWEI, LI HAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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