Method for manufacturing high-integration microarray LED packaging module

Method for manufacturing high-integration microarray LED packaging module

The invention provides a method for manufacturing a high-integration microarray LED packaging module. The method comprises the steps of S1, providing an LED prefabricated part which comprises a microarray lens cover plate and an epitaxial wafer, and cleaning the surface of the epitaxial wafer; S2, c...

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Hauptverfasser: WANG XIAOPENG, LI FENG, YANG SISI, HAO JINGLONG, WANG HAOWEI, LI HAO
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator WANG XIAOPENG
LI FENG
YANG SISI
HAO JINGLONG
WANG HAOWEI
LI HAO
description The invention provides a method for manufacturing a high-integration microarray LED packaging module. The method comprises the steps of S1, providing an LED prefabricated part which comprises a microarray lens cover plate and an epitaxial wafer, and cleaning the surface of the epitaxial wafer; S2, carrying out array processing on the epitaxial wafer, wherein the depth of a processed channel reaches a buffer layer, a plurality of chips arranged in an array mode are obtained, and a P electrode is arranged on the surface of the chip; S3, installing the microarray lens cover plate on the epitaxialwafer; S4, inverting the microarray lens cover plate, and performing substrate lift-off on the epitaxial wafer by adopting a laser lift-off process, wherein the lift-off position is the buffer layer;S5, cleaning residues of the buffer layer, processing the surface of the chip, and manufacturing an N electrode; and S6, mounting the microarray lens cover plate on a substrate to obtain the high-integration microarray LED pa
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for manufacturing high-integration microarray LED packaging module
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