GUIDED PATTERNING DEVICE INSPECTION
Described herein is a method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limit...
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| creator | VAN OOSTEN ANTON VAENKATESAN VIDYA PLUG REINDER WILEY JAMES |
| description | Described herein is a method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limiting pattern locations corresponding to the patterning device based on the patterning device substrate map, and based on the process window limiting pattern locations, guiding, by a hardware computer system, a patterning device inspection apparatus to the process window limiting pattern locations fordefect inspection.
本文中描述了一种用于图案化装置的检查的方法。该方法包括：获取(i)图案化装置制造工艺的图案化装置设备数据，(ii)基于图案化装置设备数据的图案化装置衬底图，以及(iii)基于图案化装置衬底图的、经预测的与图案化装置相对应的工艺窗口限制的图案位置；以及由硬件计算机系统基于工艺窗口限制的图案位置将图案化装置检查设备引导到工艺窗口限制的图案位置以进行缺陷检查。 |
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本文中描述了一种用于图案化装置的检查的方法。该方法包括：获取(i)图案化装置制造工艺的图案化装置设备数据，(ii)基于图案化装置设备数据的图案化装置衬底图，以及(iii)基于图案化装置衬底图的、经预测的与图案化装置相对应的工艺窗口限制的图案位置；以及由硬件计算机系统基于工艺窗口限制的图案位置将图案化装置检查设备引导到工艺窗口限制的图案位置以进行缺陷检查。</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201020&DB=EPODOC&CC=CN&NR=111801623A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201020&DB=EPODOC&CC=CN&NR=111801623A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VAN OOSTEN ANTON</creatorcontrib><creatorcontrib>VAENKATESAN VIDYA</creatorcontrib><creatorcontrib>PLUG REINDER</creatorcontrib><creatorcontrib>WILEY JAMES</creatorcontrib><title>GUIDED PATTERNING DEVICE INSPECTION</title><description>Described herein is a method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limiting pattern locations corresponding to the patterning device based on the patterning device substrate map, and based on the process window limiting pattern locations, guiding, by a hardware computer system, a patterning device inspection apparatus to the process window limiting pattern locations fordefect inspection.
本文中描述了一种用于图案化装置的检查的方法。该方法包括：获取(i)图案化装置制造工艺的图案化装置设备数据，(ii)基于图案化装置设备数据的图案化装置衬底图，以及(iii)基于图案化装置衬底图的、经预测的与图案化装置相对应的工艺窗口限制的图案位置；以及由硬件计算机系统基于工艺窗口限制的图案位置将图案化装置检查设备引导到工艺窗口限制的图案位置以进行缺陷检查。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB2D_V0cXVRCHAMCXEN8vP0c1dwcQ3zdHZV8PQLDnB1DvH09-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhhYGhmZGxo7GxKgBAFz5IrI</recordid><startdate>20201020</startdate><enddate>20201020</enddate><creator>VAN OOSTEN ANTON</creator><creator>VAENKATESAN VIDYA</creator><creator>PLUG REINDER</creator><creator>WILEY JAMES</creator><scope>EVB</scope></search><sort><creationdate>20201020</creationdate><title>GUIDED PATTERNING DEVICE INSPECTION</title><author>VAN OOSTEN ANTON ; VAENKATESAN VIDYA ; PLUG REINDER ; WILEY JAMES</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111801623A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>VAN OOSTEN ANTON</creatorcontrib><creatorcontrib>VAENKATESAN VIDYA</creatorcontrib><creatorcontrib>PLUG REINDER</creatorcontrib><creatorcontrib>WILEY JAMES</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VAN OOSTEN ANTON</au><au>VAENKATESAN VIDYA</au><au>PLUG REINDER</au><au>WILEY JAMES</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GUIDED PATTERNING DEVICE INSPECTION</title><date>2020-10-20</date><risdate>2020</risdate><abstract>Described herein is a method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limiting pattern locations corresponding to the patterning device based on the patterning device substrate map, and based on the process window limiting pattern locations, guiding, by a hardware computer system, a patterning device inspection apparatus to the process window limiting pattern locations fordefect inspection.
本文中描述了一种用于图案化装置的检查的方法。该方法包括：获取(i)图案化装置制造工艺的图案化装置设备数据，(ii)基于图案化装置设备数据的图案化装置衬底图，以及(iii)基于图案化装置衬底图的、经预测的与图案化装置相对应的工艺窗口限制的图案位置；以及由硬件计算机系统基于工艺窗口限制的图案位置将图案化装置检查设备引导到工艺窗口限制的图案位置以进行缺陷检查。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | GUIDED PATTERNING DEVICE INSPECTION |
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