Array substrate and manufacturing method thereof

Array substrate and manufacturing method thereof

The invention discloses an array substrate and a manufacturing method thereof. The array substrate comprises: a first metal layer which comprises at least one first metal wire arranged along a first direction and at least one first metal wire arranged along a second direction, and the first metal wi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHANG CONGLONG, SUN ZHENGJUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses an array substrate and a manufacturing method thereof. The array substrate comprises: a first metal layer which comprises at least one first metal wire arranged along a first direction and at least one first metal wire arranged along a second direction, and the first metal wire arranged along the first direction is divided into a plurality of parts which are not communicated with each other by the first metal wire arranged along the second direction; a first insulating layer; the second metal layer that is communicated with a plurality of parts, which are not communicated with one another, of the first metal wire arranged along the first direction through a plurality of first via holes; a second insulating layer; and the third metal layer that enables the first metal wires arranged along the first direction to be communicated with the first metal wires arranged along the second direction through the plurality of second via holes. According to the invention, thedriving voltage lead netw