Multilayer circuit board containing aluminum core and manufacturing method thereof
The invention discloses a multilayer circuit board containing an aluminum core. An upper-layer FR-4 plate, an aluminum core plate and a lower-layer FR-4 plate are sequentially arranged from top to bottom. The upper layer FR-4 plate comprises an FR-4 plate body and copper foil pieces attached to the...
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| creator | MA RAN HU JIN'AN HUANG JINGZHONG WEN HONGYING |
| description | The invention discloses a multilayer circuit board containing an aluminum core. An upper-layer FR-4 plate, an aluminum core plate and a lower-layer FR-4 plate are sequentially arranged from top to bottom. The upper layer FR-4 plate comprises an FR-4 plate body and copper foil pieces attached to the two side faces of the FR-4 plate body, the width of the aluminum core plate is smaller than that ofthe upper FR-4 plate body and that of the lower FR-4 plate body, and the aluminum core plate comprises an aluminum core plate body, a first PP adhesive layer arranged on the upper surface of the aluminum core plate body and a second PP adhesive layer arranged on the lower surface of the aluminum core plate body. According to the multi-layer circuit board containing the aluminum core, the two endsof the first PP adhesive layer and the two ends of the second PP adhesive layer are in contact with each other; the gap between the two ends of the aluminum core board body is filled, the aluminum core board body can be comple |
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An upper-layer FR-4 plate, an aluminum core plate and a lower-layer FR-4 plate are sequentially arranged from top to bottom. The upper layer FR-4 plate comprises an FR-4 plate body and copper foil pieces attached to the two side faces of the FR-4 plate body, the width of the aluminum core plate is smaller than that ofthe upper FR-4 plate body and that of the lower FR-4 plate body, and the aluminum core plate comprises an aluminum core plate body, a first PP adhesive layer arranged on the upper surface of the aluminum core plate body and a second PP adhesive layer arranged on the lower surface of the aluminum core plate body. According to the multi-layer circuit board containing the aluminum core, the two endsof the first PP adhesive layer and the two ends of the second PP adhesive layer are in contact with each other; the gap between the two ends of the aluminum core board body is filled, the aluminum core board body can be comple</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201013&DB=EPODOC&CC=CN&NR=111770649A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201013&DB=EPODOC&CC=CN&NR=111770649A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MA RAN</creatorcontrib><creatorcontrib>HU JIN'AN</creatorcontrib><creatorcontrib>HUANG JINGZHONG</creatorcontrib><creatorcontrib>WEN HONGYING</creatorcontrib><title>Multilayer circuit board containing aluminum core and manufacturing method thereof</title><description>The invention discloses a multilayer circuit board containing an aluminum core. An upper-layer FR-4 plate, an aluminum core plate and a lower-layer FR-4 plate are sequentially arranged from top to bottom. The upper layer FR-4 plate comprises an FR-4 plate body and copper foil pieces attached to the two side faces of the FR-4 plate body, the width of the aluminum core plate is smaller than that ofthe upper FR-4 plate body and that of the lower FR-4 plate body, and the aluminum core plate comprises an aluminum core plate body, a first PP adhesive layer arranged on the upper surface of the aluminum core plate body and a second PP adhesive layer arranged on the lower surface of the aluminum core plate body. According to the multi-layer circuit board containing the aluminum core, the two endsof the first PP adhesive layer and the two ends of the second PP adhesive layer are in contact with each other; the gap between the two ends of the aluminum core board body is filled, the aluminum core board body can be comple</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEKAjEQANNYiPqH9QGCQfGwlEOx0ULsjzXZeAvJ5shtCn-vgg-wGpiZqbldalSO-KICjourrPDIWDy4LIosLE_AWBNLTR9XCFA8JJQa0Gkt355I--xBeyqUw9xMAsaRFj_OzPJ0vLfnFQ25o3FAR0LatVdrbdOsd9v9YfPP8wZ7tjjU</recordid><startdate>20201013</startdate><enddate>20201013</enddate><creator>MA RAN</creator><creator>HU JIN'AN</creator><creator>HUANG JINGZHONG</creator><creator>WEN HONGYING</creator><scope>EVB</scope></search><sort><creationdate>20201013</creationdate><title>Multilayer circuit board containing aluminum core and manufacturing method thereof</title><author>MA RAN ; HU JIN'AN ; HUANG JINGZHONG ; WEN HONGYING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111770649A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MA RAN</creatorcontrib><creatorcontrib>HU JIN'AN</creatorcontrib><creatorcontrib>HUANG JINGZHONG</creatorcontrib><creatorcontrib>WEN HONGYING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MA RAN</au><au>HU JIN'AN</au><au>HUANG JINGZHONG</au><au>WEN HONGYING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multilayer circuit board containing aluminum core and manufacturing method thereof</title><date>2020-10-13</date><risdate>2020</risdate><abstract>The invention discloses a multilayer circuit board containing an aluminum core. An upper-layer FR-4 plate, an aluminum core plate and a lower-layer FR-4 plate are sequentially arranged from top to bottom. The upper layer FR-4 plate comprises an FR-4 plate body and copper foil pieces attached to the two side faces of the FR-4 plate body, the width of the aluminum core plate is smaller than that ofthe upper FR-4 plate body and that of the lower FR-4 plate body, and the aluminum core plate comprises an aluminum core plate body, a first PP adhesive layer arranged on the upper surface of the aluminum core plate body and a second PP adhesive layer arranged on the lower surface of the aluminum core plate body. According to the multi-layer circuit board containing the aluminum core, the two endsof the first PP adhesive layer and the two ends of the second PP adhesive layer are in contact with each other; the gap between the two ends of the aluminum core board body is filled, the aluminum core board body can be comple</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Multilayer circuit board containing aluminum core and manufacturing method thereof |
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