Photosensitive resin composition
Provided is a photosensitive resin composition which has excellent coating properties by an inkjet method and which is capable of forming a cured product that has excellent flame retardancy and impermeability without impairing adhesion to a circuit pattern and electrical insulation properties. The p...
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| creator | YOSHIO OKAMOTO EINISHI HIRO |
| description | Provided is a photosensitive resin composition which has excellent coating properties by an inkjet method and which is capable of forming a cured product that has excellent flame retardancy and impermeability without impairing adhesion to a circuit pattern and electrical insulation properties. The photosensitive resin composition contains (A) a (meth) acrylic resin having a weight-average molecular weight of 500 or more, (B) a (meth) acrylic compound having a weight-average molecular weight of less than 500, (C) a phosphorus-based flame retardant, and (D) a photopolymerization initiator. Wherein the phosphorus-based flame retardant (C) is in the form of a powder, and has a solubility of 10 parts by mass or more dissolved with respect to 100 parts by mass of the (meth) acrylic compound (B)having a weight average molecular weight of less than 500 at 25 DEG C.
本发明提供一种感光性树脂组合物，其利用喷墨法的涂敷性优异、另外能够形成不会使与电路图案的密接性以及电绝缘性受损而阻燃性以及抗渗性优异的固化物。该感光性树脂组合物含有(A)重均分子量为500以上的(甲基)丙烯酸系树脂、(B)重均分子量小于500的(甲基)丙烯酸系化合物、(C)磷系阻燃剂、以及(D)光聚合引发剂 |
| format | Patent |
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本发明提供一种感光性树脂组合物，其利用喷墨法的涂敷性优异、另外能够形成不会使与电路图案的密接性以及电绝缘性受损而阻燃性以及抗渗性优异的固化物。该感光性树脂组合物含有(A)重均分子量为500以上的(甲基)丙烯酸系树脂、(B)重均分子量小于500的(甲基)丙烯酸系化合物、(C)磷系阻燃剂、以及(D)光聚合引发剂</description><language>chi ; eng</language><subject>ADHESIVES ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; CINEMATOGRAPHY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTROGRAPHY ; FILLING PASTES ; HOLOGRAPHY ; INKS ; MATERIALS THEREFOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORIGINALS THEREFOR ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; POLISHES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200915&DB=EPODOC&CC=CN&NR=111665685A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200915&DB=EPODOC&CC=CN&NR=111665685A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIO OKAMOTO</creatorcontrib><creatorcontrib>EINISHI HIRO</creatorcontrib><title>Photosensitive resin composition</title><description>Provided is a photosensitive resin composition which has excellent coating properties by an inkjet method and which is capable of forming a cured product that has excellent flame retardancy and impermeability without impairing adhesion to a circuit pattern and electrical insulation properties. The photosensitive resin composition contains (A) a (meth) acrylic resin having a weight-average molecular weight of 500 or more, (B) a (meth) acrylic compound having a weight-average molecular weight of less than 500, (C) a phosphorus-based flame retardant, and (D) a photopolymerization initiator. Wherein the phosphorus-based flame retardant (C) is in the form of a powder, and has a solubility of 10 parts by mass or more dissolved with respect to 100 parts by mass of the (meth) acrylic compound (B)having a weight average molecular weight of less than 500 at 25 DEG C.
本发明提供一种感光性树脂组合物，其利用喷墨法的涂敷性优异、另外能够形成不会使与电路图案的密接性以及电绝缘性受损而阻燃性以及抗渗性优异的固化物。该感光性树脂组合物含有(A)重均分子量为500以上的(甲基)丙烯酸系树脂、(B)重均分子量小于500的(甲基)丙烯酸系化合物、(C)磷系阻燃剂、以及(D)光聚合引发剂</description><subject>ADHESIVES</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTROGRAPHY</subject><subject>FILLING PASTES</subject><subject>HOLOGRAPHY</subject><subject>INKS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORIGINALS THEREFOR</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAIyMgvyS9OzSvOLMksS1UoSi3OzFNIzs8tyAeJ5OfxMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQ0MzM1MzC1NHY2LUAACjSSYO</recordid><startdate>20200915</startdate><enddate>20200915</enddate><creator>YOSHIO OKAMOTO</creator><creator>EINISHI HIRO</creator><scope>EVB</scope></search><sort><creationdate>20200915</creationdate><title>Photosensitive resin composition</title><author>YOSHIO OKAMOTO ; EINISHI HIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111665685A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ADHESIVES</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTROGRAPHY</topic><topic>FILLING PASTES</topic><topic>HOLOGRAPHY</topic><topic>INKS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORIGINALS THEREFOR</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIO OKAMOTO</creatorcontrib><creatorcontrib>EINISHI HIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIO OKAMOTO</au><au>EINISHI HIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photosensitive resin composition</title><date>2020-09-15</date><risdate>2020</risdate><abstract>Provided is a photosensitive resin composition which has excellent coating properties by an inkjet method and which is capable of forming a cured product that has excellent flame retardancy and impermeability without impairing adhesion to a circuit pattern and electrical insulation properties. The photosensitive resin composition contains (A) a (meth) acrylic resin having a weight-average molecular weight of 500 or more, (B) a (meth) acrylic compound having a weight-average molecular weight of less than 500, (C) a phosphorus-based flame retardant, and (D) a photopolymerization initiator. Wherein the phosphorus-based flame retardant (C) is in the form of a powder, and has a solubility of 10 parts by mass or more dissolved with respect to 100 parts by mass of the (meth) acrylic compound (B)having a weight average molecular weight of less than 500 at 25 DEG C.
本发明提供一种感光性树脂组合物，其利用喷墨法的涂敷性优异、另外能够形成不会使与电路图案的密接性以及电绝缘性受损而阻燃性以及抗渗性优异的固化物。该感光性树脂组合物含有(A)重均分子量为500以上的(甲基)丙烯酸系树脂、(B)重均分子量小于500的(甲基)丙烯酸系化合物、(C)磷系阻燃剂、以及(D)光聚合引发剂</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Photosensitive resin composition |
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