SEMICONDUCTOR PACKAGE WITH HEATSINK

According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of thesubstrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	QUINONES MARIA CLEMENS YPIL, AGDON CABAHUG ELSIE, TEYSSEYRE JEROME
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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