SEMICONDUCTOR PACKAGE WITH HEATSINK
According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of thesubstrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where...
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| creator | QUINONES MARIA CLEMENS YPIL AGDON CABAHUG ELSIE TEYSSEYRE JEROME |
| description | According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of thesubstrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where at least a portion of the first surface is exposed through the molding such that the substrate is configured to function as a heat sink.
本发明涉及"具有热沉的半导体封装"。根据一方面，一种半导体封装包括具有第一表面和与第一表面相对的第二表面的衬底，耦接到衬底的第二表面的半导体管芯，以及包封半导体管芯和衬底的大部分的模塑件，其中第一表面的至少一部分通过模塑件暴露，使得衬底被配置成充当热沉。 |
| format | Patent |
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本发明涉及"具有热沉的半导体封装"。根据一方面，一种半导体封装包括具有第一表面和与第一表面相对的第二表面的衬底，耦接到衬底的第二表面的半导体管芯，以及包封半导体管芯和衬底的大部分的模塑件，其中第一表面的至少一部分通过模塑件暴露，使得衬底被配置成充当热沉。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200904&DB=EPODOC&CC=CN&NR=111627872A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200904&DB=EPODOC&CC=CN&NR=111627872A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QUINONES MARIA CLEMENS YPIL</creatorcontrib><creatorcontrib>AGDON CABAHUG ELSIE</creatorcontrib><creatorcontrib>TEYSSEYRE JEROME</creatorcontrib><title>SEMICONDUCTOR PACKAGE WITH HEATSINK</title><description>According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of thesubstrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where at least a portion of the first surface is exposed through the molding such that the substrate is configured to function as a heat sink.
本发明涉及"具有热沉的半导体封装"。根据一方面，一种半导体封装包括具有第一表面和与第一表面相对的第二表面的衬底，耦接到衬底的第二表面的半导体管芯，以及包封半导体管芯和衬底的大部分的模塑件，其中第一表面的至少一部分通过模塑件暴露，使得衬底被配置成充当热沉。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAOdvX1dPb3cwl1DvEPUghwdPZ2dHdVCPcM8VDwcHUMCfb08-ZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhmZG5hbmRo7GxKgBAGPLIs4</recordid><startdate>20200904</startdate><enddate>20200904</enddate><creator>QUINONES MARIA CLEMENS YPIL</creator><creator>AGDON CABAHUG ELSIE</creator><creator>TEYSSEYRE JEROME</creator><scope>EVB</scope></search><sort><creationdate>20200904</creationdate><title>SEMICONDUCTOR PACKAGE WITH HEATSINK</title><author>QUINONES MARIA CLEMENS YPIL ; AGDON CABAHUG ELSIE ; TEYSSEYRE JEROME</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111627872A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>QUINONES MARIA CLEMENS YPIL</creatorcontrib><creatorcontrib>AGDON CABAHUG ELSIE</creatorcontrib><creatorcontrib>TEYSSEYRE JEROME</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QUINONES MARIA CLEMENS YPIL</au><au>AGDON CABAHUG ELSIE</au><au>TEYSSEYRE JEROME</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR PACKAGE WITH HEATSINK</title><date>2020-09-04</date><risdate>2020</risdate><abstract>According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of thesubstrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where at least a portion of the first surface is exposed through the molding such that the substrate is configured to function as a heat sink.
本发明涉及"具有热沉的半导体封装"。根据一方面，一种半导体封装包括具有第一表面和与第一表面相对的第二表面的衬底，耦接到衬底的第二表面的半导体管芯，以及包封半导体管芯和衬底的大部分的模塑件，其中第一表面的至少一部分通过模塑件暴露，使得衬底被配置成充当热沉。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR PACKAGE WITH HEATSINK |
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