CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME

One embodiment of the present invention is a method for producing a connection structure, which comprises a step: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode that is formed on the first substrate and a second electronic member whi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUKUI TAKAHIRO, SHIRAKAWA TETSUYUKI, IWAMOTO SHINNOSUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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