CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME
One embodiment of the present invention is a method for producing a connection structure, which comprises a step: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode that is formed on the first substrate and a second electronic member whi...
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| creator | FUKUI TAKAHIRO SHIRAKAWA TETSUYUKI IWAMOTO SHINNOSUKE |
| description | One embodiment of the present invention is a method for producing a connection structure, which comprises a step: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode that is formed on the first substrate and a second electronic member which has a second substrate and a second electrode that is formed on the second substrate; and the first electronic member and the second electronic member are compression bonded to each other, with the adhesive layer being interposed therebetween, so that the first electrode and the second electrodeare electrically connected to each other. The first electronic member additionally has an insulating layer that is formed on a surface of the first electrode, said surface being on the reverse side ofthe first substrate-side surface; and the adhesive layer contains first conductive particles, each of which has the form of a dendrite, and second conductive particles which are conductive particlesother than the first conduc |
| format | Patent |
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The first electronic member additionally has an insulating layer that is formed on a surface of the first electrode, said surface being on the reverse side ofthe first substrate-side surface; and the adhesive layer contains first conductive particles, each of which has the form of a dendrite, and second conductive particles which are conductive particlesother than the first conduc</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CURRENT COLLECTORS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200807&DB=EPODOC&CC=CN&NR=111512502A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200807&DB=EPODOC&CC=CN&NR=111512502A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUI TAKAHIRO</creatorcontrib><creatorcontrib>SHIRAKAWA TETSUYUKI</creatorcontrib><creatorcontrib>IWAMOTO SHINNOSUKE</creatorcontrib><title>CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME</title><description>One embodiment of the present invention is a method for producing a connection structure, which comprises a step: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode that is formed on the first substrate and a second electronic member which has a second substrate and a second electrode that is formed on the second substrate; and the first electronic member and the second electronic member are compression bonded to each other, with the adhesive layer being interposed therebetween, so that the first electrode and the second electrodeare electrically connected to each other. The first electronic member additionally has an insulating layer that is formed on a surface of the first electrode, said surface being on the reverse side ofthe first substrate-side surface; and the adhesive layer contains first conductive particles, each of which has the form of a dendrite, and second conductive particles which are conductive particlesother than the first conduc</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CURRENT COLLECTORS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBy9vfzc3UO8fT3UwgOCQp1DgkNclVw9HNR8HUN8fB3UXDzD1IICPJ3CXX29HNXCHb0deVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhqaGRqYGRo7GxKgBAITEJso</recordid><startdate>20200807</startdate><enddate>20200807</enddate><creator>FUKUI TAKAHIRO</creator><creator>SHIRAKAWA TETSUYUKI</creator><creator>IWAMOTO SHINNOSUKE</creator><scope>EVB</scope></search><sort><creationdate>20200807</creationdate><title>CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME</title><author>FUKUI TAKAHIRO ; SHIRAKAWA TETSUYUKI ; IWAMOTO SHINNOSUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111512502A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CURRENT COLLECTORS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKUI TAKAHIRO</creatorcontrib><creatorcontrib>SHIRAKAWA TETSUYUKI</creatorcontrib><creatorcontrib>IWAMOTO SHINNOSUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKUI TAKAHIRO</au><au>SHIRAKAWA TETSUYUKI</au><au>IWAMOTO SHINNOSUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME</title><date>2020-08-07</date><risdate>2020</risdate><abstract>One embodiment of the present invention is a method for producing a connection structure, which comprises a step: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode that is formed on the first substrate and a second electronic member which has a second substrate and a second electrode that is formed on the second substrate; and the first electronic member and the second electronic member are compression bonded to each other, with the adhesive layer being interposed therebetween, so that the first electrode and the second electrodeare electrically connected to each other. The first electronic member additionally has an insulating layer that is formed on a surface of the first electrode, said surface being on the reverse side ofthe first substrate-side surface; and the adhesive layer contains first conductive particles, each of which has the form of a dendrite, and second conductive particles which are conductive particlesother than the first conduc</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES |
| title | CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME |
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