CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME

One embodiment of the present invention is a method for producing a connection structure, which comprises a step: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode that is formed on the first substrate and a second electronic member which has a second substrate and a second electrode that is formed on the second substrate; and the first electronic member and the second electronic member are compression bonded to each other, with the adhesive layer being interposed therebetween, so that the first electrode and the second electrodeare electrically connected to each other. The first electronic member additionally has an insulating layer that is formed on a surface of the first electrode, said surface being on the reverse side ofthe first substrate-side surface; and the adhesive layer contains first conductive particles, each of which has the form of a dendrite, and second conductive particles which are conductive particlesother than the first conduc