ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frameare disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper si...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KE CHUNI, TSAI YINGOU, TSAI WEN-JUNG, YEH MAO-HUA, CHIU CHIH-HSIEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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