HOLDING METHOD OF WORKPIECES AND PROCESSING METHOD OF WORKPIECES

HOLDING METHOD OF WORKPIECES AND PROCESSING METHOD OF WORKPIECES

Provided are a holding method of workpieces and a processing method of workpieces. When holding and processing a bowl-shaped workpiece having warpage, foreign matter adhesion due to pressing of the workpiece is prevented, and the workpiece is held by suction by means of a holding surface and appropr...

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Hauptverfasser: ATENDIDO PAUL VINCENT, MIYAGI YUSUKE
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ATENDIDO PAUL VINCENT
MIYAGI YUSUKE
description Provided are a holding method of workpieces and a processing method of workpieces. When holding and processing a bowl-shaped workpiece having warpage, foreign matter adhesion due to pressing of the workpiece is prevented, and the workpiece is held by suction by means of a holding surface and appropriate processing is performed. The holding method of a workpiece having a bowl-shaped warp includes amounting step of mounting the workpiece (W) on the holding surface (31) of a holding unit (30), wherein the holding unit (30) comprises a holding surface (31) for holding the workpiece, a suction hole opening (320) to the holding surface (31), and a suction passage (33) for making selective communication between the suction hole (320) and a vacuum source (339); a liquid supplying step of supplying a liquid (L) to the workpiece (W) held on the holding surface (31) so that the liquid flows into a gap defined between the holding surface (31) and the workpiece (W); and a suction step of bringingthe suction hole (320) int
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HOLDING METHOD OF WORKPIECES AND PROCESSING METHOD OF WORKPIECES
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