Wireless router with novel heat dissipation structure
The invention relates to the field of router equipment, and particularly discloses a wireless router with a novel heat dissipation structure, which comprises a shell and a router host fixedly mountedin the shell, a heat conduction side plate is arranged on the side wall of the router host, and a hea...
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| creator | YAO XIANGYING |
| description | The invention relates to the field of router equipment, and particularly discloses a wireless router with a novel heat dissipation structure, which comprises a shell and a router host fixedly mountedin the shell, a heat conduction side plate is arranged on the side wall of the router host, and a heat conduction bottom plate is arranged on the bottom plate of the router host; an air distribution annular cavity is formed among the shell, the rotating cylinder, the rotating air distribution disc and the fixed cylinder, a plurality of hollow pipes used for blowing air in the air distribution annular cavity to the surface of a heat conduction side plate on the side wall of the router host are arranged on the rotating air distribution disc, and a plurality of air distribution openings obliquelyfacing the heat conduction side plate are formed in the hollow pipes. According to the embodiment of the invention, the bottom air blowing assembly blows air to the heat conduction bottom plate on the bottom surface of the ro |
| format | Patent |
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According to the embodiment of the invention, the bottom air blowing assembly blows air to the heat conduction bottom plate on the bottom surface of the ro</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTING ; TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200703&DB=EPODOC&CC=CN&NR=111372146A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200703&DB=EPODOC&CC=CN&NR=111372146A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAO XIANGYING</creatorcontrib><title>Wireless router with novel heat dissipation structure</title><description>The invention relates to the field of router equipment, and particularly discloses a wireless router with a novel heat dissipation structure, which comprises a shell and a router host fixedly mountedin the shell, a heat conduction side plate is arranged on the side wall of the router host, and a heat conduction bottom plate is arranged on the bottom plate of the router host; an air distribution annular cavity is formed among the shell, the rotating cylinder, the rotating air distribution disc and the fixed cylinder, a plurality of hollow pipes used for blowing air in the air distribution annular cavity to the surface of a heat conduction side plate on the side wall of the router host are arranged on the rotating air distribution disc, and a plurality of air distribution openings obliquelyfacing the heat conduction side plate are formed in the hollow pipes. 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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTING TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION |
| title | Wireless router with novel heat dissipation structure |
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