Transfer printing method of micro light emitting diode and micro light emitting diode display panel

The invention discloses a micro light-emitting diode transfer printing method and a micro light-emitting diode display panel, and aims to solve the problems that when a micro light-emitting diode is manufactured in a steel mesh printing mode in the prior art, a steel mesh with a large size is difficult to manufacture, the mesh size is difficult to control, printing deviation occurs, and lamp explosion occurs easily. The transfer printing method comprises the steps: forming welding flux on a transfer substrate; controlling a micro light emitting diode of a first substrate to dip the solder of the transfer substrate; and fixing the micro light emitting diode dipped with the solder on a bonding pad through the solder. 本发明公开了一种微发光二极管的转印方法及微发光二极管显示面板，以改善现有技术通过钢网印刷方式制作微发光二极管时，存在制作较大尺寸的钢网较难，网孔尺寸较难控制，印刷偏位，以及容易存现爆灯的问题。所述转印方法，包括：在中转基板形成焊料；控制第一基板的微发光二极管蘸取所述中转基板的所述焊料；将蘸取有所述焊料的所述微发光二极管通过所述焊料固定在焊盘上。