Treatment method for cutting piece, and associated equipment

Treatment method for cutting piece, and associated equipment

The invention relates to a method of treatment of a cutting piece (2). This method comprises a first step in which a cutting surface (5) of this cutting piece (2) is subjected to shots thrown by an ultrasonic shot peening apparatus (10) to become a cutting surface (5) with shot impacts, and a second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JEANNEAU JULIEN, CHATEAU FREDERIC, RICHET PIERRE, SPONEM FLORENT
Format: Patent
Sprache:chi ; eng
Schlagworte:
ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
GRINDING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:The invention relates to a method of treatment of a cutting piece (2). This method comprises a first step in which a cutting surface (5) of this cutting piece (2) is subjected to shots thrown by an ultrasonic shot peening apparatus (10) to become a cutting surface (5) with shot impacts, and a second step in which the cutting surface (5) with shot impacts is grinded over a chosen thickness to become a treated cutting surface (5). 本发明涉及处理切割件(2)的方法。所述方法包括：第一步骤，其中使该切割件(2)的切割表面(5)经受由超声喷丸装置(10)喷射的丸粒以变为经丸粒冲击的切割表面(5)；和第二步骤，其中将经丸粒冲击的切割表面(5)以选定的厚度磨削以变为经处理的切割表面(5)。