Track system and method for processing semiconductor wafers

The present disclosure provides a track system for processing semiconductor wafers held by a plurality of front opening universal pods (FOUPs). The track system includes a process zone, a first commonzone, and a second common zone. The process zone includes a first group of process modules and a sec...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JANG SUNGKUN, LIM JONG-KILL, KWON BYUNG-IN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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