Spectroscopic system, optical inspection device and semiconductor device manufacturing method
The disclosure relates to a spectroscopic system, an optical inspection device and a semiconductor device manufacturing method. A semiconductor device manufacturing method includes performing a firsttreatment process on a substrate, inspecting the substrate using a spectroscopic system that includes...
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creator | SOHN YOUNGHOON KO KANG-WOONG KIM MINSU YANG YUSIN JANG SUNGHO |
description | The disclosure relates to a spectroscopic system, an optical inspection device and a semiconductor device manufacturing method. A semiconductor device manufacturing method includes performing a firsttreatment process on a substrate, inspecting the substrate using a spectroscopic system that includes a light entrance part, a light exit part, a diffraction grating, and controllable mirror equipment, and performing a second treatment process of the substrate. The step of performing the inspection process includes separating incident light into a plurality of light rays each having different wavelengths, the incident light being provided to the light entrance part and diffracted at the diffraction grating, and moving the controllable mirror device to reflect a first light ray from among the plurality of light rays having a first wavelength to the light exit part.
本公开涉及光谱系统、光学检查装置和半导体器件制造方法。该半导体器件制造方法包括对基板执行第一处理工艺;使用光谱系统检查基板,所述光谱系统包括光入射部件、光出射部件、衍射光栅和可控反射镜设备;以及对被执行了所述第一处理工艺的所述基板执行第二处理工艺。执行检查工艺的步骤包括:将入射光分离成各自具有不同波长的 |
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本公开涉及光谱系统、光学检查装置和半导体器件制造方法。该半导体器件制造方法包括对基板执行第一处理工艺;使用光谱系统检查基板,所述光谱系统包括光入射部件、光出射部件、衍射光栅和可控反射镜设备;以及对被执行了所述第一处理工艺的所述基板执行第二处理工艺。执行检查工艺的步骤包括:将入射光分离成各自具有不同波长的</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200623&DB=EPODOC&CC=CN&NR=111326434A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200623&DB=EPODOC&CC=CN&NR=111326434A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SOHN YOUNGHOON</creatorcontrib><creatorcontrib>KO KANG-WOONG</creatorcontrib><creatorcontrib>KIM MINSU</creatorcontrib><creatorcontrib>YANG YUSIN</creatorcontrib><creatorcontrib>JANG SUNGHO</creatorcontrib><title>Spectroscopic system, optical inspection device and semiconductor device manufacturing method</title><description>The disclosure relates to a spectroscopic system, an optical inspection device and a semiconductor device manufacturing method. A semiconductor device manufacturing method includes performing a firsttreatment process on a substrate, inspecting the substrate using a spectroscopic system that includes a light entrance part, a light exit part, a diffraction grating, and controllable mirror equipment, and performing a second treatment process of the substrate. The step of performing the inspection process includes separating incident light into a plurality of light rays each having different wavelengths, the incident light being provided to the light entrance part and diffracted at the diffraction grating, and moving the controllable mirror device to reflect a first light ray from among the plurality of light rays having a first wavelength to the light exit part.
本公开涉及光谱系统、光学检查装置和半导体器件制造方法。该半导体器件制造方法包括对基板执行第一处理工艺;使用光谱系统检查基板,所述光谱系统包括光入射部件、光出射部件、衍射光栅和可控反射镜设备;以及对被执行了所述第一处理工艺的所述基板执行第二处理工艺。执行检查工艺的步骤包括:将入射光分离成各自具有不同波长的</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwkAMgOEuDqK-Q9x1qC3uUhQnF12lHLnUBnrJ0aSCby-C7k7_8P3z4n7NhD6qoWZGsJc5pQ1odsYwAIt9nFUg0pORIEgEo8SoEid0HX-QgkxdQJ9Glgck8l7jsph1YTBafbso1qfjrTlvKWtLlgOSkLfNpSzLarevq_pQ_fO8AYdgPTc</recordid><startdate>20200623</startdate><enddate>20200623</enddate><creator>SOHN YOUNGHOON</creator><creator>KO KANG-WOONG</creator><creator>KIM MINSU</creator><creator>YANG YUSIN</creator><creator>JANG SUNGHO</creator><scope>EVB</scope></search><sort><creationdate>20200623</creationdate><title>Spectroscopic system, optical inspection device and semiconductor device manufacturing method</title><author>SOHN YOUNGHOON ; KO KANG-WOONG ; KIM MINSU ; YANG YUSIN ; JANG SUNGHO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111326434A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SOHN YOUNGHOON</creatorcontrib><creatorcontrib>KO KANG-WOONG</creatorcontrib><creatorcontrib>KIM MINSU</creatorcontrib><creatorcontrib>YANG YUSIN</creatorcontrib><creatorcontrib>JANG SUNGHO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SOHN YOUNGHOON</au><au>KO KANG-WOONG</au><au>KIM MINSU</au><au>YANG YUSIN</au><au>JANG SUNGHO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Spectroscopic system, optical inspection device and semiconductor device manufacturing method</title><date>2020-06-23</date><risdate>2020</risdate><abstract>The disclosure relates to a spectroscopic system, an optical inspection device and a semiconductor device manufacturing method. A semiconductor device manufacturing method includes performing a firsttreatment process on a substrate, inspecting the substrate using a spectroscopic system that includes a light entrance part, a light exit part, a diffraction grating, and controllable mirror equipment, and performing a second treatment process of the substrate. The step of performing the inspection process includes separating incident light into a plurality of light rays each having different wavelengths, the incident light being provided to the light entrance part and diffracted at the diffraction grating, and moving the controllable mirror device to reflect a first light ray from among the plurality of light rays having a first wavelength to the light exit part.
本公开涉及光谱系统、光学检查装置和半导体器件制造方法。该半导体器件制造方法包括对基板执行第一处理工艺;使用光谱系统检查基板,所述光谱系统包括光入射部件、光出射部件、衍射光栅和可控反射镜设备;以及对被执行了所述第一处理工艺的所述基板执行第二处理工艺。执行检查工艺的步骤包括:将入射光分离成各自具有不同波长的</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING |
title | Spectroscopic system, optical inspection device and semiconductor device manufacturing method |
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