METHOD FOR MANUFACTURING NON-VOLATILE MEMORY
A method for manufacturing a non-volatile memory, comprising the following steps: forming a gate oxide layer (60) on a substrate (50); forming a stacked capacitor of a memory unit by subjecting logicgate polycrystalline silicon (10, 10') to a deposition process at least twice; removing excess l...
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creator | WANG TENGFENG NING DAN |
description | A method for manufacturing a non-volatile memory, comprising the following steps: forming a gate oxide layer (60) on a substrate (50); forming a stacked capacitor of a memory unit by subjecting logicgate polycrystalline silicon (10, 10') to a deposition process at least twice; removing excess logic gate polycrystalline silicon (10, 10') by means of an etching process to form a memory transistor and a peripheral logic transistor. By forming a stacked capacitor of a memory unit by means of at least two deposition processes, the method manufactures a memory during a standard logic process such that the process for manufacturing a memory is simpler, has good compatibility with logic processes and is low cost.
一种非挥发性存储器的制造方法,包括步骤:在基底(50)上形成栅氧化层(60);将逻辑栅极多晶硅(10,10')通过至少两次沉积过程后,形成存储单元的叠层电容;通过蚀刻工艺移除多余的逻辑栅极多晶硅(10,10'),形成存储晶体管和外围逻辑晶体管。本发明所述方法,通过至少两次沉积形成存储晶体管的叠层电容,于标准逻辑工艺中制造出存储器,使得存储器的制造工艺更简单,与逻辑工艺兼容性好,成本低。 |
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一种非挥发性存储器的制造方法,包括步骤:在基底(50)上形成栅氧化层(60);将逻辑栅极多晶硅(10,10')通过至少两次沉积过程后,形成存储单元的叠层电容;通过蚀刻工艺移除多余的逻辑栅极多晶硅(10,10'),形成存储晶体管和外围逻辑晶体管。本发明所述方法,通过至少两次沉积形成存储晶体管的叠层电容,于标准逻辑工艺中制造出存储器,使得存储器的制造工艺更简单,与逻辑工艺兼容性好,成本低。</description><language>chi ; eng</language><subject>ELECTRICITY</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200619&DB=EPODOC&CC=CN&NR=111316439A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200619&DB=EPODOC&CC=CN&NR=111316439A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG TENGFENG</creatorcontrib><creatorcontrib>NING DAN</creatorcontrib><title>METHOD FOR MANUFACTURING NON-VOLATILE MEMORY</title><description>A method for manufacturing a non-volatile memory, comprising the following steps: forming a gate oxide layer (60) on a substrate (50); forming a stacked capacitor of a memory unit by subjecting logicgate polycrystalline silicon (10, 10') to a deposition process at least twice; removing excess logic gate polycrystalline silicon (10, 10') by means of an etching process to form a memory transistor and a peripheral logic transistor. By forming a stacked capacitor of a memory unit by means of at least two deposition processes, the method manufactures a memory during a standard logic process such that the process for manufacturing a memory is simpler, has good compatibility with logic processes and is low cost.
一种非挥发性存储器的制造方法,包括步骤:在基底(50)上形成栅氧化层(60);将逻辑栅极多晶硅(10,10')通过至少两次沉积过程后,形成存储单元的叠层电容;通过蚀刻工艺移除多余的逻辑栅极多晶硅(10,10'),形成存储晶体管和外围逻辑晶体管。本发明所述方法,通过至少两次沉积形成存储晶体管的叠层电容,于标准逻辑工艺中制造出存储器,使得存储器的制造工艺更简单,与逻辑工艺兼容性好,成本低。</description><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNX8PP30w3z93EM8fRxVfB19fUPiuRhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhsaGZibGlo7GxKgBAKseJVo</recordid><startdate>20200619</startdate><enddate>20200619</enddate><creator>WANG TENGFENG</creator><creator>NING DAN</creator><scope>EVB</scope></search><sort><creationdate>20200619</creationdate><title>METHOD FOR MANUFACTURING NON-VOLATILE MEMORY</title><author>WANG TENGFENG ; NING DAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111316439A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG TENGFENG</creatorcontrib><creatorcontrib>NING DAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG TENGFENG</au><au>NING DAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING NON-VOLATILE MEMORY</title><date>2020-06-19</date><risdate>2020</risdate><abstract>A method for manufacturing a non-volatile memory, comprising the following steps: forming a gate oxide layer (60) on a substrate (50); forming a stacked capacitor of a memory unit by subjecting logicgate polycrystalline silicon (10, 10') to a deposition process at least twice; removing excess logic gate polycrystalline silicon (10, 10') by means of an etching process to form a memory transistor and a peripheral logic transistor. By forming a stacked capacitor of a memory unit by means of at least two deposition processes, the method manufactures a memory during a standard logic process such that the process for manufacturing a memory is simpler, has good compatibility with logic processes and is low cost.
一种非挥发性存储器的制造方法,包括步骤:在基底(50)上形成栅氧化层(60);将逻辑栅极多晶硅(10,10')通过至少两次沉积过程后,形成存储单元的叠层电容;通过蚀刻工艺移除多余的逻辑栅极多晶硅(10,10'),形成存储晶体管和外围逻辑晶体管。本发明所述方法,通过至少两次沉积形成存储晶体管的叠层电容,于标准逻辑工艺中制造出存储器,使得存储器的制造工艺更简单,与逻辑工艺兼容性好,成本低。</abstract><oa>free_for_read</oa></addata></record> |
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title | METHOD FOR MANUFACTURING NON-VOLATILE MEMORY |
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