Chemical mechanical polishing apparatus for controlling polishing uniformity

A chemical mechanical polishing (CMP) apparatus includes a polishing pad on a polishing platen, a polishing head on the polishing pad, the polishing head having a membrane to hold a wafer on the polishing pad, and a polishing slurry feeding line to feed a polishing slurry, and a retainer ring around...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BAE SANG-WON, KIM IN-KWON, JANG SUN-JAE, LEE HYO-SAN, PARK SEUNG-HO, LEE WOO-IN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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