Thick copper circuit board laminating process and laminating device

The invention relates to a thick copper circuit board laminating process and a laminating device. The process comprises the following steps: S1, preparing a substrate, S2, forming a positioning hole in the substrate and a prepreg, S3, placing the substrate on a supporting table, S4, coating the surface of the substrate with liquid gum, and then, stacking the prepreg on the substrate, S5, baking the substrate and the prepreg, and S6, carrying out lamination to obtain a required laminated circuit board. During lamination, the glue of the prepreg does not fill the etching groove in the circuit pattern, so that the thickness of the board is uniform; and meanwhile, positioning columns are used for positioning the substrate and the prepreg, so that the substrate and the prepreg are accurately aligned, and the laminating quality is improved. 本发明涉及一种厚铜电路板层压工艺及层压装置，其工艺包括以下步骤，步骤S1：准备好基板，步骤S2：在基板和半固化片上开好定位孔，步骤S3：将基板放置在承托台上，步骤S4：在基板的表面涂上液态树胶，然后将半固化片叠放在基板上，步骤S5：对基板和半固化片进行烘烤，步骤S6：进行压合，制得所需要的层压电路板。层压时，半固化片的胶水不会对线路图形中的蚀刻凹槽进行