Motor control device with built-in shunt resistor and built-in power transistor
The invention relates to a motor control device with a built-in shunt resistor and a built-in power transistor. The motor control device comprises a high thermal conductivity substrate; the conductiveloop is arranged on the high-heat-conductivity substrate in a heat-conducting manner and comprises a...
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creator | YU HEJIE HUANG ANZHENG LIN JUNYOU LIAON ZHENGLONG |
description | The invention relates to a motor control device with a built-in shunt resistor and a built-in power transistor. The motor control device comprises a high thermal conductivity substrate; the conductiveloop is arranged on the high-heat-conductivity substrate in a heat-conducting manner and comprises a first heat-conducting connecting pad part and a second heat-conducting connecting pad part which are arranged at an interval; the high-power transistor is conductively connected to the conductive loop; the shunt resistor is conductively connected to the high-power transistor; wherein the thermal expansion coefficient of the body is larger than that of the high-thermal-conductivity substrate. The welding parts extend from the body; wherein the body has a predetermined width, the width of the welding part is larger than the predetermined width, and the body and the high-thermal-conductivity substrate are arranged at intervals, so that when the welding part is welded to the first thermal-conductivity connection pad p |
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The motor control device comprises a high thermal conductivity substrate; the conductiveloop is arranged on the high-heat-conductivity substrate in a heat-conducting manner and comprises a first heat-conducting connecting pad part and a second heat-conducting connecting pad part which are arranged at an interval; the high-power transistor is conductively connected to the conductive loop; the shunt resistor is conductively connected to the high-power transistor; wherein the thermal expansion coefficient of the body is larger than that of the high-thermal-conductivity substrate. The welding parts extend from the body; wherein the body has a predetermined width, the width of the welding part is larger than the predetermined width, and the body and the high-thermal-conductivity substrate are arranged at intervals, so that when the welding part is welded to the first thermal-conductivity connection pad p</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-PROPELLEDVEHICLES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES, IN GENERAL ; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING ; VEHICLES IN GENERAL</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200616&DB=EPODOC&CC=CN&NR=111284331A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200616&DB=EPODOC&CC=CN&NR=111284331A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YU HEJIE</creatorcontrib><creatorcontrib>HUANG ANZHENG</creatorcontrib><creatorcontrib>LIN JUNYOU</creatorcontrib><creatorcontrib>LIAON ZHENGLONG</creatorcontrib><title>Motor control device with built-in shunt resistor and built-in power transistor</title><description>The invention relates to a motor control device with a built-in shunt resistor and a built-in power transistor. The motor control device comprises a high thermal conductivity substrate; the conductiveloop is arranged on the high-heat-conductivity substrate in a heat-conducting manner and comprises a first heat-conducting connecting pad part and a second heat-conducting connecting pad part which are arranged at an interval; the high-power transistor is conductively connected to the conductive loop; the shunt resistor is conductively connected to the high-power transistor; wherein the thermal expansion coefficient of the body is larger than that of the high-thermal-conductivity substrate. 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The motor control device comprises a high thermal conductivity substrate; the conductiveloop is arranged on the high-heat-conductivity substrate in a heat-conducting manner and comprises a first heat-conducting connecting pad part and a second heat-conducting connecting pad part which are arranged at an interval; the high-power transistor is conductively connected to the conductive loop; the shunt resistor is conductively connected to the high-power transistor; wherein the thermal expansion coefficient of the body is larger than that of the high-thermal-conductivity substrate. The welding parts extend from the body; wherein the body has a predetermined width, the width of the welding part is larger than the predetermined width, and the body and the high-thermal-conductivity substrate are arranged at intervals, so that when the welding part is welded to the first thermal-conductivity connection pad p</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-PROPELLEDVEHICLES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES, IN GENERAL MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING VEHICLES IN GENERAL |
title | Motor control device with built-in shunt resistor and built-in power transistor |
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