Computer electronic component cooling device

Computer electronic component cooling device

The invention belongs to the technical field of heat dissipation, and relates to a computer electronic component cooling device. The computer electronic component cooling device comprises a shell, a convection fan, a metal water tank, an external water tank, an air exhaust mechanism and the like, wh...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHOU DEFENG, FENG XIN, OUYANG GUANG, HUANG YINXIU, CUI YUAN, GUO ZHONGMEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ZHOU DEFENG
FENG XIN
OUYANG GUANG
HUANG YINXIU
CUI YUAN
GUO ZHONGMEI
description The invention belongs to the technical field of heat dissipation, and relates to a computer electronic component cooling device. The computer electronic component cooling device comprises a shell, a convection fan, a metal water tank, an external water tank, an air exhaust mechanism and the like, wherein a convection fan and a dryer are arranged in the shell; the air exhaust mechanism mounted in the shell pumps away moisture generated by the fins and the permeation metal cone due to heating of the CPU unit; the forced air flow carrying a large amount of water vapor is prevented from diffusingto the periphery of the CPU unit and but is pumped to the air exhaust mechanism; therefore, the situation that computer electronic elements are irreversibly broken due to the fact that forced air flowcarrying a large amount of water vapor leaks from a traditional evaporation heat dissipation sealing channel is avoided, and the effect of protecting the computer electronic elements is achieved. Inaddition, the evaporation h
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN111240442A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN111240442A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN111240442A3</originalsourceid><addsrcrecordid>eNrjZNBxzs8tKC1JLVJIzUlNLinKz8tMVkgGiuXnpeaVAFn5OZl56QopqWWZyak8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_Q0NDIxMDExMjRmBg1AMUxKh4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Computer electronic component cooling device</title><source>esp@cenet</source><creator>ZHOU DEFENG ; FENG XIN ; OUYANG GUANG ; HUANG YINXIU ; CUI YUAN ; GUO ZHONGMEI</creator><creatorcontrib>ZHOU DEFENG ; FENG XIN ; OUYANG GUANG ; HUANG YINXIU ; CUI YUAN ; GUO ZHONGMEI</creatorcontrib><description>The invention belongs to the technical field of heat dissipation, and relates to a computer electronic component cooling device. The computer electronic component cooling device comprises a shell, a convection fan, a metal water tank, an external water tank, an air exhaust mechanism and the like, wherein a convection fan and a dryer are arranged in the shell; the air exhaust mechanism mounted in the shell pumps away moisture generated by the fins and the permeation metal cone due to heating of the CPU unit; the forced air flow carrying a large amount of water vapor is prevented from diffusingto the periphery of the CPU unit and but is pumped to the air exhaust mechanism; therefore, the situation that computer electronic elements are irreversibly broken due to the fact that forced air flowcarrying a large amount of water vapor leaks from a traditional evaporation heat dissipation sealing channel is avoided, and the effect of protecting the computer electronic elements is achieved. Inaddition, the evaporation h</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200605&amp;DB=EPODOC&amp;CC=CN&amp;NR=111240442A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200605&amp;DB=EPODOC&amp;CC=CN&amp;NR=111240442A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHOU DEFENG</creatorcontrib><creatorcontrib>FENG XIN</creatorcontrib><creatorcontrib>OUYANG GUANG</creatorcontrib><creatorcontrib>HUANG YINXIU</creatorcontrib><creatorcontrib>CUI YUAN</creatorcontrib><creatorcontrib>GUO ZHONGMEI</creatorcontrib><title>Computer electronic component cooling device</title><description>The invention belongs to the technical field of heat dissipation, and relates to a computer electronic component cooling device. The computer electronic component cooling device comprises a shell, a convection fan, a metal water tank, an external water tank, an air exhaust mechanism and the like, wherein a convection fan and a dryer are arranged in the shell; the air exhaust mechanism mounted in the shell pumps away moisture generated by the fins and the permeation metal cone due to heating of the CPU unit; the forced air flow carrying a large amount of water vapor is prevented from diffusingto the periphery of the CPU unit and but is pumped to the air exhaust mechanism; therefore, the situation that computer electronic elements are irreversibly broken due to the fact that forced air flowcarrying a large amount of water vapor leaks from a traditional evaporation heat dissipation sealing channel is avoided, and the effect of protecting the computer electronic elements is achieved. Inaddition, the evaporation h</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBxzs8tKC1JLVJIzUlNLinKz8tMVkgGiuXnpeaVAFn5OZl56QopqWWZyak8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_Q0NDIxMDExMjRmBg1AMUxKh4</recordid><startdate>20200605</startdate><enddate>20200605</enddate><creator>ZHOU DEFENG</creator><creator>FENG XIN</creator><creator>OUYANG GUANG</creator><creator>HUANG YINXIU</creator><creator>CUI YUAN</creator><creator>GUO ZHONGMEI</creator><scope>EVB</scope></search><sort><creationdate>20200605</creationdate><title>Computer electronic component cooling device</title><author>ZHOU DEFENG ; FENG XIN ; OUYANG GUANG ; HUANG YINXIU ; CUI YUAN ; GUO ZHONGMEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111240442A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHOU DEFENG</creatorcontrib><creatorcontrib>FENG XIN</creatorcontrib><creatorcontrib>OUYANG GUANG</creatorcontrib><creatorcontrib>HUANG YINXIU</creatorcontrib><creatorcontrib>CUI YUAN</creatorcontrib><creatorcontrib>GUO ZHONGMEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHOU DEFENG</au><au>FENG XIN</au><au>OUYANG GUANG</au><au>HUANG YINXIU</au><au>CUI YUAN</au><au>GUO ZHONGMEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Computer electronic component cooling device</title><date>2020-06-05</date><risdate>2020</risdate><abstract>The invention belongs to the technical field of heat dissipation, and relates to a computer electronic component cooling device. The computer electronic component cooling device comprises a shell, a convection fan, a metal water tank, an external water tank, an air exhaust mechanism and the like, wherein a convection fan and a dryer are arranged in the shell; the air exhaust mechanism mounted in the shell pumps away moisture generated by the fins and the permeation metal cone due to heating of the CPU unit; the forced air flow carrying a large amount of water vapor is prevented from diffusingto the periphery of the CPU unit and but is pumped to the air exhaust mechanism; therefore, the situation that computer electronic elements are irreversibly broken due to the fact that forced air flowcarrying a large amount of water vapor leaks from a traditional evaporation heat dissipation sealing channel is avoided, and the effect of protecting the computer electronic elements is achieved. Inaddition, the evaporation h</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN111240442A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
title Computer electronic component cooling device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T01%3A10%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHOU%20DEFENG&rft.date=2020-06-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN111240442A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true