LASER PROCESSING APPARATUS
In the laser processing apparatus for simultaneously processing from both sides of the bonded substrate, the laser light does not return to the laser light source. The laser processing apparatus 1 isan apparatus for processing simultaneously from both sides of the bonded substrate W, and includes a...
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| creator | NAKATANI IKUYOSHI |
| description | In the laser processing apparatus for simultaneously processing from both sides of the bonded substrate, the laser light does not return to the laser light source. The laser processing apparatus 1 isan apparatus for processing simultaneously from both sides of the bonded substrate W, and includes a laser oscillator 15, a polarization beam splitter 37, a first optical system 5B, and a second optical system 5C. The polarization beam splitter 37 branches the laser light L from the laser oscillator into the first branch light L1 and the second branch light L2. The polarization beam splitter 37 rotates the polarization direction of the second branch light L2 at a predetermined angle with respect to the first branch light L1. The 1st optical system 5B irradiates the 1st branch light L1 to the 1st surface of the substrate W. The 2nd optical system 5C irradiates the 2nd branch light L2 to the 2nd surface of the substrate W.
一种激光加工装置，用于从贴合基板的两侧同时进行加工，在该激光加工装置中，激光不会返回到激光光源。一种激光加工装置(1)，用于从贴合基板(W)的两侧同时进行加工，并具备：激光振荡器(15)、 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN111230312A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN111230312A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN111230312A3</originalsourceid><addsrcrecordid>eNrjZJDycQx2DVIICPJ3dg0O9vRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhkbGBsaGRo7GxKgBAD1NIEI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LASER PROCESSING APPARATUS</title><source>esp@cenet</source><creator>NAKATANI IKUYOSHI</creator><creatorcontrib>NAKATANI IKUYOSHI</creatorcontrib><description>In the laser processing apparatus for simultaneously processing from both sides of the bonded substrate, the laser light does not return to the laser light source. The laser processing apparatus 1 isan apparatus for processing simultaneously from both sides of the bonded substrate W, and includes a laser oscillator 15, a polarization beam splitter 37, a first optical system 5B, and a second optical system 5C. The polarization beam splitter 37 branches the laser light L from the laser oscillator into the first branch light L1 and the second branch light L2. The polarization beam splitter 37 rotates the polarization direction of the second branch light L2 at a predetermined angle with respect to the first branch light L1. The 1st optical system 5B irradiates the 1st branch light L1 to the 1st surface of the substrate W. The 2nd optical system 5C irradiates the 2nd branch light L2 to the 2nd surface of the substrate W.
一种激光加工装置，用于从贴合基板的两侧同时进行加工，在该激光加工装置中，激光不会返回到激光光源。一种激光加工装置(1)，用于从贴合基板(W)的两侧同时进行加工，并具备：激光振荡器(15)、</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200605&DB=EPODOC&CC=CN&NR=111230312A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200605&DB=EPODOC&CC=CN&NR=111230312A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKATANI IKUYOSHI</creatorcontrib><title>LASER PROCESSING APPARATUS</title><description>In the laser processing apparatus for simultaneously processing from both sides of the bonded substrate, the laser light does not return to the laser light source. The laser processing apparatus 1 isan apparatus for processing simultaneously from both sides of the bonded substrate W, and includes a laser oscillator 15, a polarization beam splitter 37, a first optical system 5B, and a second optical system 5C. The polarization beam splitter 37 branches the laser light L from the laser oscillator into the first branch light L1 and the second branch light L2. The polarization beam splitter 37 rotates the polarization direction of the second branch light L2 at a predetermined angle with respect to the first branch light L1. The 1st optical system 5B irradiates the 1st branch light L1 to the 1st surface of the substrate W. The 2nd optical system 5C irradiates the 2nd branch light L2 to the 2nd surface of the substrate W.
一种激光加工装置，用于从贴合基板的两侧同时进行加工，在该激光加工装置中，激光不会返回到激光光源。一种激光加工装置(1)，用于从贴合基板(W)的两侧同时进行加工，并具备：激光振荡器(15)、</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDycQx2DVIICPJ3dg0O9vRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhkbGBsaGRo7GxKgBAD1NIEI</recordid><startdate>20200605</startdate><enddate>20200605</enddate><creator>NAKATANI IKUYOSHI</creator><scope>EVB</scope></search><sort><creationdate>20200605</creationdate><title>LASER PROCESSING APPARATUS</title><author>NAKATANI IKUYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111230312A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKATANI IKUYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKATANI IKUYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER PROCESSING APPARATUS</title><date>2020-06-05</date><risdate>2020</risdate><abstract>In the laser processing apparatus for simultaneously processing from both sides of the bonded substrate, the laser light does not return to the laser light source. The laser processing apparatus 1 isan apparatus for processing simultaneously from both sides of the bonded substrate W, and includes a laser oscillator 15, a polarization beam splitter 37, a first optical system 5B, and a second optical system 5C. The polarization beam splitter 37 branches the laser light L from the laser oscillator into the first branch light L1 and the second branch light L2. The polarization beam splitter 37 rotates the polarization direction of the second branch light L2 at a predetermined angle with respect to the first branch light L1. The 1st optical system 5B irradiates the 1st branch light L1 to the 1st surface of the substrate W. The 2nd optical system 5C irradiates the 2nd branch light L2 to the 2nd surface of the substrate W.
一种激光加工装置，用于从贴合基板的两侧同时进行加工，在该激光加工装置中，激光不会返回到激光光源。一种激光加工装置(1)，用于从贴合基板(W)的两侧同时进行加工，并具备：激光振荡器(15)、</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER PROCESSING APPARATUS |
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