Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor
This polyimide includes an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride, and a 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, as acid dianhydrides, and a 3,3'-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine, as diamines. This polyimi...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KONDO YASUTAKA |
| description | This polyimide includes an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride, and a 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, as acid dianhydrides, and a 3,3'-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine, as diamines. This polyimide film includes the abovementioned polyimide resin. The polyimide film can be obtained by applying, on a substrate, a polyimide solution obtained by dissolving the polyimide resin in an organic solvent, and removing the solvent.
本发明的聚酰亚胺包含脂环式二酸酐、含氟芳香族二酸酐、以及3,3',4,4'-联苯四羧酸二酐作为二酸酐，包含3,3'-二氨基二苯基砜和氟烷基取代联苯胺作为二胺。本发明的聚酰亚胺薄膜包含上述聚酰亚胺树脂。例如，将在有机溶剂中溶解有聚酰亚胺树脂的聚酰亚胺溶液涂布在基材上并去除溶剂，由此可得到聚酰亚胺薄膜。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN111212867A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN111212867A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN111212867A3</originalsourceid><addsrcrecordid>eNrjZCgNyM-pzMzNTElVKEotzsxTSMxLUSgoyk8pTS7JzM9TyE0tychPUSjJSC1KTcsv0lEogKsvzs8pBanRgeiBi6dl5uQSMIaHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkaGhoZGlmYmTsaE6MGADlbRd8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor</title><source>esp@cenet</source><creator>KONDO YASUTAKA</creator><creatorcontrib>KONDO YASUTAKA</creatorcontrib><description>This polyimide includes an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride, and a 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, as acid dianhydrides, and a 3,3'-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine, as diamines. This polyimide film includes the abovementioned polyimide resin. The polyimide film can be obtained by applying, on a substrate, a polyimide solution obtained by dissolving the polyimide resin in an organic solvent, and removing the solvent.
本发明的聚酰亚胺包含脂环式二酸酐、含氟芳香族二酸酐、以及3,3',4,4'-联苯四羧酸二酐作为二酸酐，包含3,3'-二氨基二苯基砜和氟烷基取代联苯胺作为二胺。本发明的聚酰亚胺薄膜包含上述聚酰亚胺树脂。例如，将在有机溶剂中溶解有聚酰亚胺树脂的聚酰亚胺溶液涂布在基材上并去除溶剂，由此可得到聚酰亚胺薄膜。</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200529&DB=EPODOC&CC=CN&NR=111212867A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200529&DB=EPODOC&CC=CN&NR=111212867A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KONDO YASUTAKA</creatorcontrib><title>Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor</title><description>This polyimide includes an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride, and a 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, as acid dianhydrides, and a 3,3'-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine, as diamines. This polyimide film includes the abovementioned polyimide resin. The polyimide film can be obtained by applying, on a substrate, a polyimide solution obtained by dissolving the polyimide resin in an organic solvent, and removing the solvent.
本发明的聚酰亚胺包含脂环式二酸酐、含氟芳香族二酸酐、以及3,3',4,4'-联苯四羧酸二酐作为二酸酐，包含3,3'-二氨基二苯基砜和氟烷基取代联苯胺作为二胺。本发明的聚酰亚胺薄膜包含上述聚酰亚胺树脂。例如，将在有机溶剂中溶解有聚酰亚胺树脂的聚酰亚胺溶液涂布在基材上并去除溶剂，由此可得到聚酰亚胺薄膜。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCgNyM-pzMzNTElVKEotzsxTSMxLUSgoyk8pTS7JzM9TyE0tychPUSjJSC1KTcsv0lEogKsvzs8pBanRgeiBi6dl5uQSMIaHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkaGhoZGlmYmTsaE6MGADlbRd8</recordid><startdate>20200529</startdate><enddate>20200529</enddate><creator>KONDO YASUTAKA</creator><scope>EVB</scope></search><sort><creationdate>20200529</creationdate><title>Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor</title><author>KONDO YASUTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111212867A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KONDO YASUTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KONDO YASUTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor</title><date>2020-05-29</date><risdate>2020</risdate><abstract>This polyimide includes an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride, and a 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, as acid dianhydrides, and a 3,3'-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine, as diamines. This polyimide film includes the abovementioned polyimide resin. The polyimide film can be obtained by applying, on a substrate, a polyimide solution obtained by dissolving the polyimide resin in an organic solvent, and removing the solvent.
本发明的聚酰亚胺包含脂环式二酸酐、含氟芳香族二酸酐、以及3,3',4,4'-联苯四羧酸二酐作为二酸酐，包含3,3'-二氨基二苯基砜和氟烷基取代联苯胺作为二胺。本发明的聚酰亚胺薄膜包含上述聚酰亚胺树脂。例如，将在有机溶剂中溶解有聚酰亚胺树脂的聚酰亚胺溶液涂布在基材上并去除溶剂，由此可得到聚酰亚胺薄膜。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN111212867A |
| source | esp@cenet |
| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-21T20%3A00%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KONDO%20YASUTAKA&rft.date=2020-05-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN111212867A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |