Heat conduction device
The invention discloses a heat conduction device which comprises a device body and a heat pipe, a cavity is formed in the device body and is filled with a working fluid, the heat pipe penetrates through the device body, and one section of the heat pipe abuts against the cavity. The heat conduction d...
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| creator | LI JUQIANG |
| description | The invention discloses a heat conduction device which comprises a device body and a heat pipe, a cavity is formed in the device body and is filled with a working fluid, the heat pipe penetrates through the device body, and one section of the heat pipe abuts against the cavity. The heat conduction device is high in heat dissipation efficiency and good in heat dissipation effect.
本发明公开了一种热传导器件，包括器件本体和热管，所述器件本体内部设置有腔体，所述腔体内填充有工作流体，所述热管穿过器件本体，所述热管其中一段紧靠腔体。本发明散热效率高，散热效果好。 |
| format | Patent |
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本发明公开了一种热传导器件，包括器件本体和热管，所述器件本体内部设置有腔体，所述腔体内填充有工作流体，所述热管穿过器件本体，所述热管其中一段紧靠腔体。本发明散热效率高，散热效果好。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200515&DB=EPODOC&CC=CN&NR=111163612A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200515&DB=EPODOC&CC=CN&NR=111163612A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI JUQIANG</creatorcontrib><title>Heat conduction device</title><description>The invention discloses a heat conduction device which comprises a device body and a heat pipe, a cavity is formed in the device body and is filled with a working fluid, the heat pipe penetrates through the device body, and one section of the heat pipe abuts against the cavity. The heat conduction device is high in heat dissipation efficiency and good in heat dissipation effect.
本发明公开了一种热传导器件，包括器件本体和热管，所述器件本体内部设置有腔体，所述腔体内填充有工作流体，所述热管穿过器件本体，所述热管其中一段紧靠腔体。本发明散热效率高，散热效果好。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDzSE0sUUjOz0spTS7JzM9TSEkty0xO5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hkBgZmxmaORoTIwaAJHGIVE</recordid><startdate>20200515</startdate><enddate>20200515</enddate><creator>LI JUQIANG</creator><scope>EVB</scope></search><sort><creationdate>20200515</creationdate><title>Heat conduction device</title><author>LI JUQIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111163612A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LI JUQIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI JUQIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat conduction device</title><date>2020-05-15</date><risdate>2020</risdate><abstract>The invention discloses a heat conduction device which comprises a device body and a heat pipe, a cavity is formed in the device body and is filled with a working fluid, the heat pipe penetrates through the device body, and one section of the heat pipe abuts against the cavity. The heat conduction device is high in heat dissipation efficiency and good in heat dissipation effect.
本发明公开了一种热传导器件，包括器件本体和热管，所述器件本体内部设置有腔体，所述腔体内填充有工作流体，所述热管穿过器件本体，所述热管其中一段紧靠腔体。本发明散热效率高，散热效果好。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Heat conduction device |
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