LTCC substrate cavity temporary filling mixed glue and filling method
The invention discloses an LTCC substrate cavity temporary filling mixed glue and a filling method, and belongs to the technical field of LTCC substrate surface film processes. The mixed glue is formed by mixing inorganic particles and photoresist, and the mixing method mainly comprises the steps: p...
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| creator | LIANG GUANGHUA TANG XIAOPING XU YAXIN CHEN YU YAN YINGZHAN LU HUIXIANG LIU XIAOLAN ZHUANG ZHIXUE DANG YUANLAN |
| description | The invention discloses an LTCC substrate cavity temporary filling mixed glue and a filling method, and belongs to the technical field of LTCC substrate surface film processes. The mixed glue is formed by mixing inorganic particles and photoresist, and the mixing method mainly comprises the steps: preparing the mixed glue, filling the mixed glue, curing the mixed glue and the like. According to the invention, inorganic particles are doped in the organic photoresist, the cavity is filled with the mixed glue in a dispensing manner, and temporary filling is completed by baking. A cavity insert filled with the mixed glue has the advantages of being small in volume change, stable in physical property, good in process compatibility, easy to remove after machining is completed and the like.
本发明公开了一种LTCC基板腔体临时填充混合胶及填充方法，属于LTCC基板表面薄膜工艺技术领域。该混合胶由无机颗和光刻胶混合而成，该混合方法主要包括混合胶的制备、混合胶的填充、混合胶的固化等步骤。本发明将无机颗粒掺杂在有机光刻胶中，通过点胶方式将混合胶填充到腔体中，并烘烤完成临时填充。采用本发明混合胶及填充方法填充的腔体嵌件具有体积变化小，物理特性稳定，工艺兼容性好，加工完成后易去除等特点。 |
| format | Patent |
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本发明公开了一种LTCC基板腔体临时填充混合胶及填充方法，属于LTCC基板表面薄膜工艺技术领域。该混合胶由无机颗和光刻胶混合而成，该混合方法主要包括混合胶的制备、混合胶的填充、混合胶的固化等步骤。本发明将无机颗粒掺杂在有机光刻胶中，通过点胶方式将混合胶填充到腔体中，并烘烤完成临时填充。采用本发明混合胶及填充方法填充的腔体嵌件具有体积变化小，物理特性稳定，工艺兼容性好，加工完成后易去除等特点。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200508&DB=EPODOC&CC=CN&NR=111128902A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200508&DB=EPODOC&CC=CN&NR=111128902A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIANG GUANGHUA</creatorcontrib><creatorcontrib>TANG XIAOPING</creatorcontrib><creatorcontrib>XU YAXIN</creatorcontrib><creatorcontrib>CHEN YU</creatorcontrib><creatorcontrib>YAN YINGZHAN</creatorcontrib><creatorcontrib>LU HUIXIANG</creatorcontrib><creatorcontrib>LIU XIAOLAN</creatorcontrib><creatorcontrib>ZHUANG ZHIXUE</creatorcontrib><creatorcontrib>DANG YUANLAN</creatorcontrib><title>LTCC substrate cavity temporary filling mixed glue and filling method</title><description>The invention discloses an LTCC substrate cavity temporary filling mixed glue and a filling method, and belongs to the technical field of LTCC substrate surface film processes. The mixed glue is formed by mixing inorganic particles and photoresist, and the mixing method mainly comprises the steps: preparing the mixed glue, filling the mixed glue, curing the mixed glue and the like. According to the invention, inorganic particles are doped in the organic photoresist, the cavity is filled with the mixed glue in a dispensing manner, and temporary filling is completed by baking. A cavity insert filled with the mixed glue has the advantages of being small in volume change, stable in physical property, good in process compatibility, easy to remove after machining is completed and the like.
本发明公开了一种LTCC基板腔体临时填充混合胶及填充方法，属于LTCC基板表面薄膜工艺技术领域。该混合胶由无机颗和光刻胶混合而成，该混合方法主要包括混合胶的制备、混合胶的填充、混合胶的固化等步骤。本发明将无机颗粒掺杂在有机光刻胶中，通过点胶方式将混合胶填充到腔体中，并烘烤完成临时填充。采用本发明混合胶及填充方法填充的腔体嵌件具有体积变化小，物理特性稳定，工艺兼容性好，加工完成后易去除等特点。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD1CXF2ViguTSouKUosSVVITizLLKlUKEnNLcgvSiyqVEjLzMnJzEtXyM2sSE1RSM8pTVVIzEtBCKeWZOSn8DCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_QyAwsrA0MHI0JkYNANdBMvY</recordid><startdate>20200508</startdate><enddate>20200508</enddate><creator>LIANG GUANGHUA</creator><creator>TANG XIAOPING</creator><creator>XU YAXIN</creator><creator>CHEN YU</creator><creator>YAN YINGZHAN</creator><creator>LU HUIXIANG</creator><creator>LIU XIAOLAN</creator><creator>ZHUANG ZHIXUE</creator><creator>DANG YUANLAN</creator><scope>EVB</scope></search><sort><creationdate>20200508</creationdate><title>LTCC substrate cavity temporary filling mixed glue and filling method</title><author>LIANG GUANGHUA ; TANG XIAOPING ; XU YAXIN ; CHEN YU ; YAN YINGZHAN ; LU HUIXIANG ; LIU XIAOLAN ; ZHUANG ZHIXUE ; DANG YUANLAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111128902A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIANG GUANGHUA</creatorcontrib><creatorcontrib>TANG XIAOPING</creatorcontrib><creatorcontrib>XU YAXIN</creatorcontrib><creatorcontrib>CHEN YU</creatorcontrib><creatorcontrib>YAN YINGZHAN</creatorcontrib><creatorcontrib>LU HUIXIANG</creatorcontrib><creatorcontrib>LIU XIAOLAN</creatorcontrib><creatorcontrib>ZHUANG ZHIXUE</creatorcontrib><creatorcontrib>DANG YUANLAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIANG GUANGHUA</au><au>TANG XIAOPING</au><au>XU YAXIN</au><au>CHEN YU</au><au>YAN YINGZHAN</au><au>LU HUIXIANG</au><au>LIU XIAOLAN</au><au>ZHUANG ZHIXUE</au><au>DANG YUANLAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LTCC substrate cavity temporary filling mixed glue and filling method</title><date>2020-05-08</date><risdate>2020</risdate><abstract>The invention discloses an LTCC substrate cavity temporary filling mixed glue and a filling method, and belongs to the technical field of LTCC substrate surface film processes. The mixed glue is formed by mixing inorganic particles and photoresist, and the mixing method mainly comprises the steps: preparing the mixed glue, filling the mixed glue, curing the mixed glue and the like. According to the invention, inorganic particles are doped in the organic photoresist, the cavity is filled with the mixed glue in a dispensing manner, and temporary filling is completed by baking. A cavity insert filled with the mixed glue has the advantages of being small in volume change, stable in physical property, good in process compatibility, easy to remove after machining is completed and the like.
本发明公开了一种LTCC基板腔体临时填充混合胶及填充方法，属于LTCC基板表面薄膜工艺技术领域。该混合胶由无机颗和光刻胶混合而成，该混合方法主要包括混合胶的制备、混合胶的填充、混合胶的固化等步骤。本发明将无机颗粒掺杂在有机光刻胶中，通过点胶方式将混合胶填充到腔体中，并烘烤完成临时填充。采用本发明混合胶及填充方法填充的腔体嵌件具有体积变化小，物理特性稳定，工艺兼容性好，加工完成后易去除等特点。</abstract><oa>free_for_read</oa></addata></record> |
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| title | LTCC substrate cavity temporary filling mixed glue and filling method |
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