PRINTING SCREEN FOR USE IN A METHOD FOR THROUGH-PLATING A PRINTED CIRCUIT BOARD AND USE OF SUCH A PRINTING SCREEN IN SUCH A METHOD
The invention relates to a printing screen for use in a method for through-plating a printed circuit board, the printing screen (18) comprising at least one screen hole (19a, 19b, 19c, 19d, 19e) for filling a hole (3a, 3b, 3c, 3d, 3e) of a ceramic substrate (2), which is larger than a reference hole...
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| creator | ZACHERL JURGEN BRINKIS WALDEMAR MATTMANN ERICH |
| description | The invention relates to a printing screen for use in a method for through-plating a printed circuit board, the printing screen (18) comprising at least one screen hole (19a, 19b, 19c, 19d, 19e) for filling a hole (3a, 3b, 3c, 3d, 3e) of a ceramic substrate (2), which is larger than a reference hole (3). The screen hole (19a, 19b, 19c, 19d, 19e) has a surface-reducing and surface-dividing geometry(32) which divides the screen hole (19a, 19b, 19c, 19d, 19e) into at least two hole sections. The invention further relates to a use of such a printing screen in such a method.
本发明涉及一种用于使用在用于电路板的通孔敷镀的方法中的印刷模板，其中，印刷模板(18)包括至少一个用于填充陶瓷基质(2)的相对于参考孔(3)更大的孔(3a、3b、3c、3d、3e)的模板孔(19a、19b、19c、19d、19e)。在此，模板孔(19a、19b、19c、19d、19e)具有减小面积的且分割面积的几何结构(32)，几何结构将模板孔(19a、19b、19c、19d、19e)分割成至少两个孔区段。此外，本发明涉及这种印刷模板在这种方法中的应用。 |
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本发明涉及一种用于使用在用于电路板的通孔敷镀的方法中的印刷模板，其中，印刷模板(18)包括至少一个用于填充陶瓷基质(2)的相对于参考孔(3)更大的孔(3a、3b、3c、3d、3e)的模板孔(19a、19b、19c、19d、19e)。在此，模板孔(19a、19b、19c、19d、19e)具有减小面积的且分割面积的几何结构(32)，几何结构将模板孔(19a、19b、19c、19d、19e)分割成至少两个孔区段。此外，本发明涉及这种印刷模板在这种方法中的应用。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200421&DB=EPODOC&CC=CN&NR=111052882A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200421&DB=EPODOC&CC=CN&NR=111052882A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZACHERL JURGEN</creatorcontrib><creatorcontrib>BRINKIS WALDEMAR</creatorcontrib><creatorcontrib>MATTMANN ERICH</creatorcontrib><title>PRINTING SCREEN FOR USE IN A METHOD FOR THROUGH-PLATING A PRINTED CIRCUIT BOARD AND USE OF SUCH A PRINTING SCREEN IN SUCH A METHOD</title><description>The invention relates to a printing screen for use in a method for through-plating a printed circuit board, the printing screen (18) comprising at least one screen hole (19a, 19b, 19c, 19d, 19e) for filling a hole (3a, 3b, 3c, 3d, 3e) of a ceramic substrate (2), which is larger than a reference hole (3). The screen hole (19a, 19b, 19c, 19d, 19e) has a surface-reducing and surface-dividing geometry(32) which divides the screen hole (19a, 19b, 19c, 19d, 19e) into at least two hole sections. The invention further relates to a use of such a printing screen in such a method.
本发明涉及一种用于使用在用于电路板的通孔敷镀的方法中的印刷模板，其中，印刷模板(18)包括至少一个用于填充陶瓷基质(2)的相对于参考孔(3)更大的孔(3a、3b、3c、3d、3e)的模板孔(19a、19b、19c、19d、19e)。在此，模板孔(19a、19b、19c、19d、19e)具有减小面积的且分割面积的几何结构(32)，几何结构将模板孔(19a、19b、19c、19d、19e)分割成至少两个孔区段。此外，本发明涉及这种印刷模板在这种方法中的应用。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjU0KwjAUhLtxIeodngcomIrQ7etL0gQ0KflZlyJxJVqoJ_DkSqzg0tXAzDczy-LZOW2CNi14ckIYkNZB9AK0AYSTCMry7AXlbGxV2R0x4wi5KTiQdhR1gMai44CG576V4COpL_fz8F6ek8_8ulhchuuUNrOuiq0UgVSZxnufpnE4p1t69GQYY7tDVdcV7v9hXl8BO68</recordid><startdate>20200421</startdate><enddate>20200421</enddate><creator>ZACHERL JURGEN</creator><creator>BRINKIS WALDEMAR</creator><creator>MATTMANN ERICH</creator><scope>EVB</scope></search><sort><creationdate>20200421</creationdate><title>PRINTING SCREEN FOR USE IN A METHOD FOR THROUGH-PLATING A PRINTED CIRCUIT BOARD AND USE OF SUCH A PRINTING SCREEN IN SUCH A METHOD</title><author>ZACHERL JURGEN ; BRINKIS WALDEMAR ; MATTMANN ERICH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111052882A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZACHERL JURGEN</creatorcontrib><creatorcontrib>BRINKIS WALDEMAR</creatorcontrib><creatorcontrib>MATTMANN ERICH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZACHERL JURGEN</au><au>BRINKIS WALDEMAR</au><au>MATTMANN ERICH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTING SCREEN FOR USE IN A METHOD FOR THROUGH-PLATING A PRINTED CIRCUIT BOARD AND USE OF SUCH A PRINTING SCREEN IN SUCH A METHOD</title><date>2020-04-21</date><risdate>2020</risdate><abstract>The invention relates to a printing screen for use in a method for through-plating a printed circuit board, the printing screen (18) comprising at least one screen hole (19a, 19b, 19c, 19d, 19e) for filling a hole (3a, 3b, 3c, 3d, 3e) of a ceramic substrate (2), which is larger than a reference hole (3). The screen hole (19a, 19b, 19c, 19d, 19e) has a surface-reducing and surface-dividing geometry(32) which divides the screen hole (19a, 19b, 19c, 19d, 19e) into at least two hole sections. The invention further relates to a use of such a printing screen in such a method.
本发明涉及一种用于使用在用于电路板的通孔敷镀的方法中的印刷模板，其中，印刷模板(18)包括至少一个用于填充陶瓷基质(2)的相对于参考孔(3)更大的孔(3a、3b、3c、3d、3e)的模板孔(19a、19b、19c、19d、19e)。在此，模板孔(19a、19b、19c、19d、19e)具有减小面积的且分割面积的几何结构(32)，几何结构将模板孔(19a、19b、19c、19d、19e)分割成至少两个孔区段。此外，本发明涉及这种印刷模板在这种方法中的应用。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | PRINTING SCREEN FOR USE IN A METHOD FOR THROUGH-PLATING A PRINTED CIRCUIT BOARD AND USE OF SUCH A PRINTING SCREEN IN SUCH A METHOD |
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