CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
The circuit board according to the present invention is provided with: a first layer which contains a fiber base material and a meltable fluorine-based resin impregnating the fiber base material; andsecond layers which are respectively disposed on both surfaces of the first layer and which each cont...
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| creator | YAMASAKI KENPEI TAMAKI TATSUYA OKUNAGA TAKESHI KOBAYASHI MIYUKI HAYASHI TOMOKI |
| description | The circuit board according to the present invention is provided with: a first layer which contains a fiber base material and a meltable fluorine-based resin impregnating the fiber base material; andsecond layers which are respectively disposed on both surfaces of the first layer and which each contain a non-meltable fluorine-based resin.
本发明的电路基板包括第1层和第2层，该第1层含有纤维基材和含浸于该纤维基材的熔融性的含氟树脂，该第2层在上述第1层的两个面分别配置，含有非熔融性的含氟树脂。 |
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本发明的电路基板包括第1层和第2层，该第1层含有纤维基材和含浸于该纤维基材的熔融性的含氟树脂，该第2层在上述第1层的两个面分别配置，含有非熔融性的含氟树脂。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200421&DB=EPODOC&CC=CN&NR=111052878A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200421&DB=EPODOC&CC=CN&NR=111052878A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMASAKI KENPEI</creatorcontrib><creatorcontrib>TAMAKI TATSUYA</creatorcontrib><creatorcontrib>OKUNAGA TAKESHI</creatorcontrib><creatorcontrib>KOBAYASHI MIYUKI</creatorcontrib><creatorcontrib>HAYASHI TOMOKI</creatorcontrib><title>CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR</title><description>The circuit board according to the present invention is provided with: a first layer which contains a fiber base material and a meltable fluorine-based resin impregnating the fiber base material; andsecond layers which are respectively disposed on both surfaces of the first layer and which each contain a non-meltable fluorine-based resin.
本发明的电路基板包括第1层和第2层，该第1层含有纤维基材和含浸于该纤维基材的熔融性的含氟树脂，该第2层在上述第1层的两个面分别配置，含有非熔融性的含氟树脂。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB39gxyDvUMUXDydwxyUXD0c1HwdfQLdXN0DgkN8vRzV_B1DfHwd1EI8XANcnXzD-JhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhgamRhbmFo7GxKgBAAFVJfo</recordid><startdate>20200421</startdate><enddate>20200421</enddate><creator>YAMASAKI KENPEI</creator><creator>TAMAKI TATSUYA</creator><creator>OKUNAGA TAKESHI</creator><creator>KOBAYASHI MIYUKI</creator><creator>HAYASHI TOMOKI</creator><scope>EVB</scope></search><sort><creationdate>20200421</creationdate><title>CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR</title><author>YAMASAKI KENPEI ; TAMAKI TATSUYA ; OKUNAGA TAKESHI ; KOBAYASHI MIYUKI ; HAYASHI TOMOKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111052878A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMASAKI KENPEI</creatorcontrib><creatorcontrib>TAMAKI TATSUYA</creatorcontrib><creatorcontrib>OKUNAGA TAKESHI</creatorcontrib><creatorcontrib>KOBAYASHI MIYUKI</creatorcontrib><creatorcontrib>HAYASHI TOMOKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMASAKI KENPEI</au><au>TAMAKI TATSUYA</au><au>OKUNAGA TAKESHI</au><au>KOBAYASHI MIYUKI</au><au>HAYASHI TOMOKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR</title><date>2020-04-21</date><risdate>2020</risdate><abstract>The circuit board according to the present invention is provided with: a first layer which contains a fiber base material and a meltable fluorine-based resin impregnating the fiber base material; andsecond layers which are respectively disposed on both surfaces of the first layer and which each contain a non-meltable fluorine-based resin.
本发明的电路基板包括第1层和第2层，该第1层含有纤维基材和含浸于该纤维基材的熔融性的含氟树脂，该第2层在上述第1层的两个面分别配置，含有非熔融性的含氟树脂。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR |
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