Polyimide resin preparation method and applications of polyimide resin in printing ink
The invention particularly relates to a polyimide resin preparation method and applications of the polyimide resin in printing ink. The preparation method of the polyimide resin comprises the following steps: (1) uniformly mixing a polyamide monomer containing a fluorine element and an adamantane st...
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| creator | ZHOU RUIPU ZHOU ZHONGTAO XIE GAOYI |
| description | The invention particularly relates to a polyimide resin preparation method and applications of the polyimide resin in printing ink. The preparation method of the polyimide resin comprises the following steps: (1) uniformly mixing a polyamide monomer containing a fluorine element and an adamantane structure, an aromatic tetracarboxylic dianhydride monomer, polyether amine and an end-capping reagentaccording to a molar ratio of 2:n:m:n-m+1, and reacting for 4-5 hours at 60-80 DEG C to obtain polyamic acid, wherein n is equal to 3-20, and m is equal to 1-17; and (2) reacting the polyamic acid at130-150 DEG C for 2-3 hours, and then reacting at 180-200 DEG C for 4-8 hours to obtain the polyimide resin. The photosensitive solder resist ink taking the polyimide resin as the raw material has low dielectric constant, low loss factor and excellent thermal stability, and meets the requirements of 5G communication equipment.
本发明特别涉及一种聚酰亚胺树脂的制备方法及其在油墨中的应用。本发明的聚酰亚胺树脂的制备方法，包括以下步骤：(1)按摩尔比2：n：m：n-m+1，将包括氟元素和金刚烷结构的聚酰胺单体、芳香族四羧 |
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本发明特别涉及一种聚酰亚胺树脂的制备方法及其在油墨中的应用。本发明的聚酰亚胺树脂的制备方法，包括以下步骤：(1)按摩尔比2：n：m：n-m+1，将包括氟元素和金刚烷结构的聚酰胺单体、芳香族四羧</description><language>chi ; eng</language><subject>ADHESIVES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200407&DB=EPODOC&CC=CN&NR=110964199A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200407&DB=EPODOC&CC=CN&NR=110964199A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHOU RUIPU</creatorcontrib><creatorcontrib>ZHOU ZHONGTAO</creatorcontrib><creatorcontrib>XIE GAOYI</creatorcontrib><title>Polyimide resin preparation method and applications of polyimide resin in printing ink</title><description>The invention particularly relates to a polyimide resin preparation method and applications of the polyimide resin in printing ink. The preparation method of the polyimide resin comprises the following steps: (1) uniformly mixing a polyamide monomer containing a fluorine element and an adamantane structure, an aromatic tetracarboxylic dianhydride monomer, polyether amine and an end-capping reagentaccording to a molar ratio of 2:n:m:n-m+1, and reacting for 4-5 hours at 60-80 DEG C to obtain polyamic acid, wherein n is equal to 3-20, and m is equal to 1-17; and (2) reacting the polyamic acid at130-150 DEG C for 2-3 hours, and then reacting at 180-200 DEG C for 4-8 hours to obtain the polyimide resin. The photosensitive solder resist ink taking the polyimide resin as the raw material has low dielectric constant, low loss factor and excellent thermal stability, and meets the requirements of 5G communication equipment.
本发明特别涉及一种聚酰亚胺树脂的制备方法及其在油墨中的应用。本发明的聚酰亚胺树脂的制备方法，包括以下步骤：(1)按摩尔比2：n：m：n-m+1，将包括氟元素和金刚烷结构的聚酰胺单体、芳香族四羧</description><subject>ADHESIVES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgLyM-pzMzNTElVKEotzsxTKChKLUgsSizJzM9TyE0tychPUUjMA-KCgpzMZLBwsUJ-mkIBmjawzsy8ksy8dCA7m4eBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxDv7GRoaWJqZGFpaOhoTowYAa_o6IA</recordid><startdate>20200407</startdate><enddate>20200407</enddate><creator>ZHOU RUIPU</creator><creator>ZHOU ZHONGTAO</creator><creator>XIE GAOYI</creator><scope>EVB</scope></search><sort><creationdate>20200407</creationdate><title>Polyimide resin preparation method and applications of polyimide resin in printing ink</title><author>ZHOU RUIPU ; ZHOU ZHONGTAO ; XIE GAOYI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110964199A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ADHESIVES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHOU RUIPU</creatorcontrib><creatorcontrib>ZHOU ZHONGTAO</creatorcontrib><creatorcontrib>XIE GAOYI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHOU RUIPU</au><au>ZHOU ZHONGTAO</au><au>XIE GAOYI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polyimide resin preparation method and applications of polyimide resin in printing ink</title><date>2020-04-07</date><risdate>2020</risdate><abstract>The invention particularly relates to a polyimide resin preparation method and applications of the polyimide resin in printing ink. The preparation method of the polyimide resin comprises the following steps: (1) uniformly mixing a polyamide monomer containing a fluorine element and an adamantane structure, an aromatic tetracarboxylic dianhydride monomer, polyether amine and an end-capping reagentaccording to a molar ratio of 2:n:m:n-m+1, and reacting for 4-5 hours at 60-80 DEG C to obtain polyamic acid, wherein n is equal to 3-20, and m is equal to 1-17; and (2) reacting the polyamic acid at130-150 DEG C for 2-3 hours, and then reacting at 180-200 DEG C for 4-8 hours to obtain the polyimide resin. The photosensitive solder resist ink taking the polyimide resin as the raw material has low dielectric constant, low loss factor and excellent thermal stability, and meets the requirements of 5G communication equipment.
本发明特别涉及一种聚酰亚胺树脂的制备方法及其在油墨中的应用。本发明的聚酰亚胺树脂的制备方法，包括以下步骤：(1)按摩尔比2：n：m：n-m+1，将包括氟元素和金刚烷结构的聚酰胺单体、芳香族四羧</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Polyimide resin preparation method and applications of polyimide resin in printing ink |
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