Sensor package structure

Sensor package structure

Disclosed is a sensor package structure which includes a substrate (1), a sensor chip (2) on the substrate (1), a ring-shaped support (4), a light permeable board (5) on the ring-shaped support (4), and an opaque package body (6) formed on the substrate (1). A top surface (21) of the sensor chip (2)...

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Hauptverfasser: LIN CHIEN-HENG, CHEN JIAN-RU, PENG CHEN-PIN, LEE CHIENN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIN CHIEN-HENG
CHEN JIAN-RU
PENG CHEN-PIN
LEE CHIENN
description Disclosed is a sensor package structure which includes a substrate (1), a sensor chip (2) on the substrate (1), a ring-shaped support (4), a light permeable board (5) on the ring-shaped support (4), and an opaque package body (6) formed on the substrate (1). A top surface (21) of the sensor chip (2) includes a spacing region (212) and a carrying region (213) surrounding the spacing region (212). The support (4) is disposed on the carrying region (213). The light permeable board (5) has a ring-shaped notch (53) recessed from an upper surface thereof, and the notch (53) includes a platform surface (531) at least partially located above the support (4) and a wall surface (532) connected to the platform surface (531) and located above the spacing region (212). A portion of the opaque package body (6) fills the notch (53) and is defined as a light shielding portion (63). An inner lateral side (42) of the support (4) is arranged in a projection area formed by orthogonally projecting the platform surface (531) onto
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Sensor package structure
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