THICKNESS MEASUREMENT SYSTEM AND METHOD

The invention provides a thickness measurement system and method. The system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured tocarry a wafer. The deposition tool is coupled to the factory interface and configured to process the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU YAN-HONG, CHEN CHE-FU, WU CHIENIH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING WEIGHING
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