THICKNESS MEASUREMENT SYSTEM AND METHOD
The invention provides a thickness measurement system and method. The system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured tocarry a wafer. The deposition tool is coupled to the factory interface and configured to process the...
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| creator | LIU YAN-HONG CHEN CHE-FU WU CHIENIH |
| description | The invention provides a thickness measurement system and method. The system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured tocarry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in thefactory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that iscarried in the factory interface or the deposition tool.
一种厚度量测系统与方法。厚度测量系统包含工厂接口、沉积工具以及至少一测量装置。工厂接口用以乘载晶圆。沉积工具耦接于工厂接口，并用以处理从工厂接口传送的晶圆。至少一测量装置设置于工厂接口、沉积工具或其组合之内。至少一测量装置用以执行晶圆上的材料的厚度的即时量测，其中晶圆由工厂接口或沉积工具乘载。 |
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一种厚度量测系统与方法。厚度测量系统包含工厂接口、沉积工具以及至少一测量装置。工厂接口用以乘载晶圆。沉积工具耦接于工厂接口，并用以处理从工厂接口传送的晶圆。至少一测量装置设置于工厂接口、沉积工具或其组合之内。至少一测量装置用以执行晶圆上的材料的厚度的即时量测，其中晶圆由工厂接口或沉积工具乘载。</description><language>chi ; eng</language><subject>MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; TESTING ; WEIGHING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200327&DB=EPODOC&CC=CN&NR=110926398A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200327&DB=EPODOC&CC=CN&NR=110926398A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU YAN-HONG</creatorcontrib><creatorcontrib>CHEN CHE-FU</creatorcontrib><creatorcontrib>WU CHIENIH</creatorcontrib><title>THICKNESS MEASUREMENT SYSTEM AND METHOD</title><description>The invention provides a thickness measurement system and method. The system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured tocarry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in thefactory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that iscarried in the factory interface or the deposition tool.
一种厚度量测系统与方法。厚度测量系统包含工厂接口、沉积工具以及至少一测量装置。工厂接口用以乘载晶圆。沉积工具耦接于工厂接口，并用以处理从工厂接口传送的晶圆。至少一测量装置设置于工厂接口、沉积工具或其组合之内。至少一测量装置用以执行晶圆上的材料的厚度的即时量测，其中晶圆由工厂接口或沉积工具乘载。</description><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>WEIGHING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAP8fB09vZzDQ5W8HV1DA4NcvV19QtRCI4MDnH1VXD0cwEKh3j4u_AwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknhnP0NDA0sjM2NLC0djYtQAAPr1JAc</recordid><startdate>20200327</startdate><enddate>20200327</enddate><creator>LIU YAN-HONG</creator><creator>CHEN CHE-FU</creator><creator>WU CHIENIH</creator><scope>EVB</scope></search><sort><creationdate>20200327</creationdate><title>THICKNESS MEASUREMENT SYSTEM AND METHOD</title><author>LIU YAN-HONG ; CHEN CHE-FU ; WU CHIENIH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110926398A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>WEIGHING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU YAN-HONG</creatorcontrib><creatorcontrib>CHEN CHE-FU</creatorcontrib><creatorcontrib>WU CHIENIH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU YAN-HONG</au><au>CHEN CHE-FU</au><au>WU CHIENIH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THICKNESS MEASUREMENT SYSTEM AND METHOD</title><date>2020-03-27</date><risdate>2020</risdate><abstract>The invention provides a thickness measurement system and method. The system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured tocarry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in thefactory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that iscarried in the factory interface or the deposition tool.
一种厚度量测系统与方法。厚度测量系统包含工厂接口、沉积工具以及至少一测量装置。工厂接口用以乘载晶圆。沉积工具耦接于工厂接口，并用以处理从工厂接口传送的晶圆。至少一测量装置设置于工厂接口、沉积工具或其组合之内。至少一测量装置用以执行晶圆上的材料的厚度的即时量测，其中晶圆由工厂接口或沉积工具乘载。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING WEIGHING |
| title | THICKNESS MEASUREMENT SYSTEM AND METHOD |
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