Engine heat cycle management system and method

The invention discloses an engine heat cycle management system and method. Through a pipeline wherein an engine work medium circulates, an interlayer is arranged on the wall of the pipeline, a semiconductor heat pump layer is arranged in the interlayer, and an inner medium cavity and an outer medium...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	HUANG JIXUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING COMBUSTION ENGINES CONTROLLING COMBUSTION ENGINES COOLING OF INTERNAL-COMBUSTION ENGINES COOLING OF MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNALCOMBUSTION ENGINES GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES ORENGINES IN GENERAL HEATING HOT GAS OR COMBUSTION-PRODUCT POSITIVE-DISPLACEMENT ENGINEPLANTS HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS LIGHTING MACHINES OR ENGINES IN GENERAL MECHANICAL ENGINEERING NOT OTHERWISE PROVIDED FOR STEAM ENGINES SUPPLYING COMBUSTION ENGINES IN GENERAL, WITH COMBUSTIBLEMIXTURES OR CONSTITUENTS THEREOF USE OF WASTE HEAT OF COMBUSTION ENGINES WEAPONS
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Beschreibung
Zusammenfassung:	The invention discloses an engine heat cycle management system and method. Through a pipeline wherein an engine work medium circulates, an interlayer is arranged on the wall of the pipeline, a semiconductor heat pump layer is arranged in the interlayer, and an inner medium cavity and an outer medium cavity are arranged on the two sides of the semiconductor heat pump layer correspondingly. In the work process, according to work media actually needing to be cooled or heated, the needed work media are selected, and the work media are made to circulate in the inner medium cavity and the outer medium cavity. A temperature detection unit is used for collecting the temperatures of the work media, an electric control unit is used for controlling the flow of the work media according to the temperatures, and therefore heat exchange is adjusted, the aim of heating or cooling is achieved, when heat exchange between the work media cannot meet requirements, the semiconductor heat pump layer is started to assist in heating