Adhesive applying device of semi-solid adhesive

The invention provides an adhesive applying device of a semi-solid adhesive. The device comprises an adhesive chamber base, an adhesive chamber sealing cover, adhesive layer thickness adjusting plates, an adhesive injection assembly and an adhesive spilling assembly. One side of the adhesive chamber...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: XUE CHUANG, ZHAO HAOJIANG, DONG JIHONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention provides an adhesive applying device of a semi-solid adhesive. The device comprises an adhesive chamber base, an adhesive chamber sealing cover, adhesive layer thickness adjusting plates, an adhesive injection assembly and an adhesive spilling assembly. One side of the adhesive chamber base comprises an adhesive injection groove and an adhesive spilling groove. Two bosses are arranged on the adhesive chamber sealing cover. The two bosses are matched with the adhesive injection groove and the adhesive splitting groove respectively and are in sealed connection with the adhesive injection groove and the adhesive splitting groove to form an adhesive injection chamber and an adhesive splitting chamber. The adhesive injection assembly is connected with the adhesive injection chamber through the adhesive chamber sealing cover for injecting an adhesive into the adhesive injection chamber. The adhesive splitting assembly is connected with the adhesive splitting chamber through theadhesive chamber sealing