Preparation method for growing KCu7S4 microwire arrays on carbon paper
A preparation method for growing KCu7S4 microwire arrays on carbon paper is disclosed. The KCu7S4 microwire arrays are evenly distributed on both surfaces of the carbon paper, and have a diameter of about 1-10 microns and a length of about 50-500 microns. The method mainly includes two steps, namely...
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| creator | ZHANG KAIYOU QIN AIMIAO WU LITING XUE YONGGANG ZHANG YU CHEN SHUOPING |
| description | A preparation method for growing KCu7S4 microwire arrays on carbon paper is disclosed. The KCu7S4 microwire arrays are evenly distributed on both surfaces of the carbon paper, and have a diameter of about 1-10 microns and a length of about 50-500 microns. The method mainly includes two steps, namely a step of copper plating on the carbon paper and a step of growing the KCu7S4 microwire arrays through a hydrothermal reaction. The step of copper plating on the carbon paper includes firstly subjecting the carbon paper to roughening, sensitizing and activation, then soaking the carbon paper in a prepared copper plating solution and cleaning and drying the paper to obtain copper plated carbon paper. The step of growing the KCu7S4 microwires includes firstly preparing a solution mixture containing anhydrous ethanol, sulfur powder, and potassium hydroxide in a certain proportion, then transferring the solution mixture to a reaction kettle lined with polytetrafluoroethylene, adding the copperplated carbon paper, seal |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN110885094A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN110885094A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN110885094A3</originalsourceid><addsrcrecordid>eNrjZHALKEotSCxKLMnMz1PITS3JyE9RSMsvUkgvyi_PzEtX8HYuNQ82UcjNTAYJFKUqJBYVJVYWKwBVJycWJQGpgsSC1CIeBta0xJziVF4ozc2g6OYa4uyhm1qQH59aXJCYnJqXWhLv7GdoaGBhYWpgaeJoTIwaAAJAMy0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Preparation method for growing KCu7S4 microwire arrays on carbon paper</title><source>esp@cenet</source><creator>ZHANG KAIYOU ; QIN AIMIAO ; WU LITING ; XUE YONGGANG ; ZHANG YU ; CHEN SHUOPING</creator><creatorcontrib>ZHANG KAIYOU ; QIN AIMIAO ; WU LITING ; XUE YONGGANG ; ZHANG YU ; CHEN SHUOPING</creatorcontrib><description>A preparation method for growing KCu7S4 microwire arrays on carbon paper is disclosed. The KCu7S4 microwire arrays are evenly distributed on both surfaces of the carbon paper, and have a diameter of about 1-10 microns and a length of about 50-500 microns. The method mainly includes two steps, namely a step of copper plating on the carbon paper and a step of growing the KCu7S4 microwire arrays through a hydrothermal reaction. The step of copper plating on the carbon paper includes firstly subjecting the carbon paper to roughening, sensitizing and activation, then soaking the carbon paper in a prepared copper plating solution and cleaning and drying the paper to obtain copper plated carbon paper. The step of growing the KCu7S4 microwires includes firstly preparing a solution mixture containing anhydrous ethanol, sulfur powder, and potassium hydroxide in a certain proportion, then transferring the solution mixture to a reaction kettle lined with polytetrafluoroethylene, adding the copperplated carbon paper, seal</description><language>chi ; eng</language><subject>CHEMISTRY ; COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F ; INORGANIC CHEMISTRY ; METALLURGY</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200317&DB=EPODOC&CC=CN&NR=110885094A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200317&DB=EPODOC&CC=CN&NR=110885094A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG KAIYOU</creatorcontrib><creatorcontrib>QIN AIMIAO</creatorcontrib><creatorcontrib>WU LITING</creatorcontrib><creatorcontrib>XUE YONGGANG</creatorcontrib><creatorcontrib>ZHANG YU</creatorcontrib><creatorcontrib>CHEN SHUOPING</creatorcontrib><title>Preparation method for growing KCu7S4 microwire arrays on carbon paper</title><description>A preparation method for growing KCu7S4 microwire arrays on carbon paper is disclosed. The KCu7S4 microwire arrays are evenly distributed on both surfaces of the carbon paper, and have a diameter of about 1-10 microns and a length of about 50-500 microns. The method mainly includes two steps, namely a step of copper plating on the carbon paper and a step of growing the KCu7S4 microwire arrays through a hydrothermal reaction. The step of copper plating on the carbon paper includes firstly subjecting the carbon paper to roughening, sensitizing and activation, then soaking the carbon paper in a prepared copper plating solution and cleaning and drying the paper to obtain copper plated carbon paper. The step of growing the KCu7S4 microwires includes firstly preparing a solution mixture containing anhydrous ethanol, sulfur powder, and potassium hydroxide in a certain proportion, then transferring the solution mixture to a reaction kettle lined with polytetrafluoroethylene, adding the copperplated carbon paper, seal</description><subject>CHEMISTRY</subject><subject>COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F</subject><subject>INORGANIC CHEMISTRY</subject><subject>METALLURGY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALKEotSCxKLMnMz1PITS3JyE9RSMsvUkgvyi_PzEtX8HYuNQ82UcjNTAYJFKUqJBYVJVYWKwBVJycWJQGpgsSC1CIeBta0xJziVF4ozc2g6OYa4uyhm1qQH59aXJCYnJqXWhLv7GdoaGBhYWpgaeJoTIwaAAJAMy0</recordid><startdate>20200317</startdate><enddate>20200317</enddate><creator>ZHANG KAIYOU</creator><creator>QIN AIMIAO</creator><creator>WU LITING</creator><creator>XUE YONGGANG</creator><creator>ZHANG YU</creator><creator>CHEN SHUOPING</creator><scope>EVB</scope></search><sort><creationdate>20200317</creationdate><title>Preparation method for growing KCu7S4 microwire arrays on carbon paper</title><author>ZHANG KAIYOU ; QIN AIMIAO ; WU LITING ; XUE YONGGANG ; ZHANG YU ; CHEN SHUOPING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110885094A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CHEMISTRY</topic><topic>COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F</topic><topic>INORGANIC CHEMISTRY</topic><topic>METALLURGY</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG KAIYOU</creatorcontrib><creatorcontrib>QIN AIMIAO</creatorcontrib><creatorcontrib>WU LITING</creatorcontrib><creatorcontrib>XUE YONGGANG</creatorcontrib><creatorcontrib>ZHANG YU</creatorcontrib><creatorcontrib>CHEN SHUOPING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG KAIYOU</au><au>QIN AIMIAO</au><au>WU LITING</au><au>XUE YONGGANG</au><au>ZHANG YU</au><au>CHEN SHUOPING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Preparation method for growing KCu7S4 microwire arrays on carbon paper</title><date>2020-03-17</date><risdate>2020</risdate><abstract>A preparation method for growing KCu7S4 microwire arrays on carbon paper is disclosed. The KCu7S4 microwire arrays are evenly distributed on both surfaces of the carbon paper, and have a diameter of about 1-10 microns and a length of about 50-500 microns. The method mainly includes two steps, namely a step of copper plating on the carbon paper and a step of growing the KCu7S4 microwire arrays through a hydrothermal reaction. The step of copper plating on the carbon paper includes firstly subjecting the carbon paper to roughening, sensitizing and activation, then soaking the carbon paper in a prepared copper plating solution and cleaning and drying the paper to obtain copper plated carbon paper. The step of growing the KCu7S4 microwires includes firstly preparing a solution mixture containing anhydrous ethanol, sulfur powder, and potassium hydroxide in a certain proportion, then transferring the solution mixture to a reaction kettle lined with polytetrafluoroethylene, adding the copperplated carbon paper, seal</abstract><oa>free_for_read</oa></addata></record> |
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| title | Preparation method for growing KCu7S4 microwire arrays on carbon paper |
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